Patent classifications
H05K1/0277
Integrated functional multilayer structure and method of manufacture therefor
A method of manufacture and an integrated functional multilayer structure, includes a substrate film formed or formable so as to exhibit a selected shape; and a number of functional, preferably including optical, mechanical, optoelectrical, electrical and/or specifically, electronic, elements, such as conductors, insulators, components and/or integrated circuits, provided upon the substrate film in the proximity of the shape; wherein the substrate film has further been provided with a structural tuning element, optionally including an elongated, circumferential or other selected shape, said structural tuning element being configured to locally control induced deformation, optionally including stretching, bending, compression and/or shearing, of the substrate film within said proximity of the shape.
DEVICE, ELECTRONIC APPARATUS, AND WIRING CONNECTION METHOD
A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.
CONDUCTIVE BASE MEMBER AND MULTILAYER CONDUCTIVE BASE MEMBER
To provide a flexible conductive base member and a multilayer conductive base member including the same, having no problem of failing to function as a contact and causing a variation in height between contacts.
There are a covered region 10 covered with a noble metal and a non-covered region 20 not circumferentially covered with a noble metal on a surface of a reticulated fibrous body 50. The covered region 10 is located at an intersection 7 of fibers 5 of the reticulated fibrous body 50, and the intersections 7 are connected to each other. The non-covered region 20 is located between the intersections 7 of the fibers 5 of the reticulated fibrous body 50.
Energy transfer system for spinal implants
An energy transfer system includes a spinal implant having an antenna, an antenna extender attached to a portion of the spinal implant in proximity to the antenna, and a reader device configured to send energy to the spinal implant via the antenna extender. The antenna extender extends away from the spinal implant. The spinal implant is configured to be positioned within a spinal area of a patient.
Stretchable electronic device
An electronic device (100) comprises a stretchable substrate (30) with a flap (30f) formed by a cut (40) in the substrate (30). The flap (30f) is disconnected by the cut (40) from a surrounding main section (30m) of the substrate (30) except on one side. The flap (30f) is exclusively connected to the main section (30m) via a connected section (30c) of the substrate (30) between two ends (40a, 40b) of the cut (40). An electronic component (10) is disposed on the flap (30f) with electrical contacts (11,12) connected to conductive tracks (21,22) disposed on the substrate (30). The conductive tracks (21,22) extend between the component (10) disposed on the flap (30f), and other parts (10r) of the electronic device (100) outside the flap (30f) via the connected section (30c). The flap (30f) with the component (10) is disposed in a pocket formed by surrounding lamination layers (31,32).
Circuit board having copper clad laminate laminated on core layer, and electronic device comprising same
Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
Display device including circuit board having sound generator
A display device including a circuit board having a sound generator includes: a base layer; conductive lines disposed on the base layer; and a sound generator disposed on the conductive lines, the sound generator contracting and expanding according to the polarity of driving voltages applied thereto.
Vibration detecting device
According to one embodiment, a vibration detecting device includes a housing, a vibration sensor, a circuit board, a flexible wiring member, and an elastic member. The vibration sensor is accommodated in the housing. The circuit board is accommodated in the housing, and is provided with a first electric component configured to process a detection signal of the vibration sensor. The wiring member electrically connects the vibration sensor and the circuit board to each other. The elastic member contains a polymer material, and is accommodated in the housing as being in contact with the housing and the circuit board, and being detachable from the housing. The circuit board is held by the housing through the elastic member.
WIRING BOARD AND METHOD FOR MANUFACTURING SAME
Provided are: a novel wiring board having flexibility derived from a resin board and the high electrical conductivity derived from a metal wiring as well as high adhesion between the metal wiring and the insulating resin board; and a method for manufacturing the wiring board without using a photolithography process. A wiring board according to the present invention comprises a resin board and a metal wiring, the metal wiring including a sintered body of metal particles, the sintered body including a plurality of voids having opening portions extending toward the resin board, parts of the resin board entering the voids from the opening portions.
Heat-rejecting media for use in dual-printed circuit board device
Heat-rejecting media configured to thermally couple to a heat-generating component of an information handling resource may include a source, a sink, and a thermally-conductive strip coupled between the source and the sink. The source may include a first flexible and thermally-conductive skin surrounding a first cavity comprising a first solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the source to the heat-generating component. The sink may include a second flexible and thermally-conductive skin surrounding a second cavity comprising a second solid foam, such that mechanical compression by components of the information handling resource provides mechanical pressure for thermally coupling the sink to a component of the information handling resource exposed externally to the information handling resource.