A method is for making an electronic device that includes a multilayer circuit board having a non-planar three-dimensional shape defining a membrane switch recess therein. The multilayer circuit board may include at least one liquid crystal polymer (LCP) layer, and at least one electrically conductive pattern layer thereon defining at least one membrane switch electrode adjacent the membrane switch recess to define a membrane switch. The electronic may further include a compressible dielectric material filling the membrane switch recess. The electronic device may also include at least one spring member within the membrane switch recess.

A cavity printed circuit board (PCB) that allows electronic components with different dimensions disposed therein is provided. A cavity with a desired dimension is formed in the cavity PCB where the electronic components may be mounted and soldered therein. The cavity formed in the cavity PCB may also provide additional flexibility regarding placements and locations where the electronic components may be disposed in the 3D vertical stacking and packaging of the IC devices so as to provide alternatives of using different types of wiring or interconnection structures or fine-pitch connection lines among the electronic components.

An image processing device that processes an image in which a wiring pattern is drawn and outputs the image as raster data in which formation content of wiring print dots is defined for each pixel, includes an input section that receives the image, a scan section that sequentially performs scanning in a scan direction at intervals of the pixel width, a calculation section that calculates an intersection-to-intersection distance in the scan direction based on positions of the intersection points, and a determination section that determines a line width of the wire in the scan direction and determine formation of dots for the determined line width for each pixel based on the intersection-to-intersection distance, the prescribed width, and a line width of an inclination wire which is the line width, in the scan direction, of a wire inclined according to the prescribed angle.

A multi-function rearview device for use with a vehicle includes a housing configured to be attached to the vehicle and to be moveable relative to the vehicle, a rearview element including at least one of a reflective element, a camera and a display element, a bezel formed at an outer portion of the multi-function rearview device surrounding the rearview element, with the rearview element being attached to at least one of the bezel and the housing, one or more light assemblies providing at least one or more light function indications, including a Human Machine Interface (HMI), and at least one sensor, the sensor controlling the one or more light assemblies or the display element.

An electronic module includes: a mount table including a first electrode mounting surface on which an electronic component is mounted; a plurality of electrode mount parts that are formed in the mount table and at which lands corresponding to a plurality of respective electrodes of the electronic component are formed on the first electrode mounting surface; a step part located between the plurality of electrode mount parts and including a predetermined step relative to the first electrode mounting surface of the mount table; and a solder withdrawing part at which an end part of a corresponding one of the lands is extended to the step part or a side surface of the mount table.

The present invention relates to a method for manufacturing an electronic or electrical system, the method comprising the layer-free production of at least one physical structure (101, 102) which is designed to guide electromagnetic waves, using at least one additively operating apparatus, wherein the layer-free production of the spatial, layer-free structure comprises the simultaneous or sequential application and/or removal of one or more materials in the spatial arrangement, as a result of which the electronic or electrical system is partially or completely formed. The invention further relates to a system which is manufactured in accordance with the method.

Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

A plated molded article 1 is characterized in that a partial region R in a surface 21 of a base material 2 is provided with a plurality of non-penetrating holes 4 of substantially corresponding shapes and substantially corresponding sizes that are formed in a scattered pattern in such a manner as to be separated from each other at a substantially averaged hole density, and a plated part 3 is formed while filling the non-penetrating holes 4 and is provided continuously over the partial region R in such a manner as to extend across the non-penetrating holes 4. It is possible to obtain a plated molded article capable of forming a required plated part in a short time on a surface of a base material and capable of improving smoothness of an outer surface of the plated part and adhesion property of the plated part.

A cover for at least one antenna emitting and/or sensing electromagnetic radiation in at least one first frequency band includes at least one first surface facing the antenna and at least one second surface averted to the antenna, and at least one first carrier layer into which hat least one heating element is embedded, the heating element being connected to a terminal at least partly extending from the first surface and/or being at least partly located on the first surface.

An electronic device package is disclosed. The electronic device package includes a board on which an electronic device is mounted, a molded portion formed to cover the electronic device on the board, and a conductive layer disposed on a surface of the molded portion and extended in a trench formed on the board.