A wiring structure includes a conductive structure and at least one conductive through via. The conductive structure includes a plurality of dielectric layers, a plurality of circuit layers in contact with the dielectric layers, and a plurality of dam portions in contact with the dielectric layers. The dam portions are stacked on and contact one another. The conductive through via extends through the dam portions.

A non-planar printed circuit board has an interior surface and an exterior surface. Between the interior surface and exterior surfaces are layers of conductive and dielectric materials. Passive and active electrical components are embedded within the interior and exterior surfaces. A hollow region is defined by the interior surface of the non-planar circuit board. The non-planar printed circuit board is manufactured on a mandrel having a non-planar shape such as, for example, a cylinder or sphere so as to form a hollow, curved non-planar structure.

A manufacturing method of a three-dimensional stretchable electronic device includes: preparing an aluminum mold for producing a substrate having one or more protrusions on an upper side and a lower side thereof; forming a path for a connection line for connecting the protrusions of the substrate using a wire; introducing a first polymer for forming the protrusions of the substrate into a predetermined portion of the aluminum mold; removing the wire and the three-dimensional stretchable substrate from the aluminum mold; injecting a liquid metal into the path for a connection line from which the wire was removed, thus manufacturing a three-dimensional stretchable substrate having a connection line; and transferring elements to the protrusions of the three-dimensional stretchable substrate having the connection line and connecting the elements to the connection line, thus connecting the elements to each other.

Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. The multi-dimensional lighting device includes external mounting surfaces, each configured to provide mounting positions for one or more substrates. A flexible jumper device electrically couples a given substrate to an adjacent substrate, and provides a predefined clearance between surfaces of the same and exposed conductive surfaces of the lighting device. Each flexible jumper includes a surface mount device (SMD) capable of being placed by automated process, such as by pick-and-place machines. Such lighting devices are thus possible using automated processes in a high-volume, highly-precise manner.

Wireless power transfer systems including wireless transmitter and receivers, which are insensitive to misalignment, are provided. A wireless power transfer system can include a first conductive loop that has cylindrical, conical, or spherical symmetry. The wireless power transfer system can further include a second conductive loop that is formed around the first conductive loop, and can also share the same type of symmetry as the first conductive loop. The wireless transfer system can be a wearable device or an implantable device.

A method of producing a wired circuit board including an insulating layer and a conductive pattern, including: (1), an insulating layer having an inclination face, (2), a metal thin film provided at least on the inclination face, (3), a photoresist provided on the surface of the metal thin film, (4), a light shield portion of a photomask disposed so that a first portion, where the conductive pattern is to be provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask, (5), the first portion of the photoresist is removed to expose the metal thin film corresponding to the first portion, and (6), the conductive pattern is provided on the surface of the metal thin film exposed from the photoresist.

To provide a cylindrical printed board in which a processing shape is maintained, and a printed-board-integrated molded article in which the cylindrical printed board is integrated with an inner wall of a hole portion in a molded article. A cylindrical printed board 1 according to the present invention is a printed board 4 including an insulator substrate 2 and a conductor pattern 3 formed on the insulator substrate 2, wherein the printed board 4 is rolled beyond one full circle to form a cylindrical shape. In addition, a printed-board-integrated molded article 40 includes a molded article 20 constituting a casing that has a cylindrical part, and the cylindrical printed board 4 that is integrated with an inner wall 21a of a hole portion 21 in the cylindrical part of the molded article 20.

A 3D printed drilling template (20, 30a, 30b, 30c) including: a rigid framework able to be manipulated by an operator or an automaton, and a set of traversing (22, 32a, 32b, 32c, 33c) orifices in the framework and arranged to guide the drilling of holes into a structure on which the drilling template is mounted, wherein the drilling template (20, 30a, 30b, 30c) is designed or revised on an ad-hoc basis and manufactured by 3D printing and using a 3D printing material based on a polymer material mixed with powdered graphene.

According to one embodiment, there is provided a printed circuit board including a substrate having a trench between a first region and a second region. The first region is a region where a first package is to be mounted. The second region is a region where a second package is to be mounted. The trench has an opening portion in at least one of a first main surface and a second main surface of the substrate. The first main surface is a surface on which the first package is placed. The second main surface is positioned on reverse side of the first main surface of the substrate.

Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire, the electrode lead wire is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire of one end of the substrate and the other end of the substrate as the other electrode lead wire. All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.