The wiring board according to the present disclosure includes: a first insulating layer including insulating particles; a plurality of first conductors located on the first insulating layer at an interval of a first distance from each other; a second conductor located on the first insulating layer at an interval of a second distance from the first conductor; and a second insulating layer located on the first insulating layer to cover the first conductor and the second conductors and including the insulating particles. When a boundary portion between the first insulating layer and the second insulating layer is viewed in cross-section in the thickness direction, the ratio of a first area occupied by the insulating particles in a first boundary portion including the first distance is higher than the ratio of a second area occupied by the insulating particles in a second boundary portion including the second distance.

A component carrier having a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure; an opening located at least partially in the stack; and a fill material which is located within the opening. The fill material is a photosensitive material, wherein at least a part of the photosensitive material has undergone a hardening treatment with electromagnetic radiation. A method for manufacturing such a component carrier is further described.

A printed wiring board according to an aspect of the present invention includes a base film having insulation properties and a conductive pattern including multiple wiring portions laminated, the conductive pattern running on at least one surface of the base film, wherein each wiring portion includes a first conductive portion and a second conductive portion coating an outer surface of the first conductive portion, wherein an average width of each wiring portion is 10 μm or greater to 50 μm or smaller, and an average thickness of the second conductive portion is 1 μn or greater to smaller than 8.5 μm.

The invention described herein provides methods and compositions for using recombinant AAV-based viral vectors to express any gene-of-interest (GOI) under its native promoter and a proprietary heterologous enhancer, preferably expressing a GOI defective in a neuronal disease or disorder in order to treat the neuronal disease or disorder.

Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, a second insulating layer disposed on the first insulating layer and covering the conductive pattern, and a third protective layer disposed between the conductive pattern and the second insulating layer and protecting the conductive pattern. The third protective layer consists of a metal oxide.

A flexible circuit package. The circuit package includes a termination point on a flexible base substrate. The termination point is connected with an interface by conductive material on the base substrate. The conductive material extends across the surface area of the base substrate in multiple individual connections, which are in communication with each other and separated by voids in the conductive material for mitigating communication failure between the termination point and the interface during or following flexion, stretching, compression or other deformation of the base substrate and the circuit package. The termination point may include an input module such as a sensor, switch or other input. The termination point may include an output module such as a light, vibrator or other output. The interface may include an output interface for receiving data or an input interface for sending a command or other signal.

Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

A circuit board assembly includes a circuit board having at least one conductive inner layer and at least one surface. Contact areas or surfaces and electrical and/or electronic components are disposed on the surface and electrically connected to the contact areas. At least two of the contact areas are connected to one another by an electrically conductive strip having ends each being connected to a respective one of the contact areas. The at least two contact areas and the electrically conductive strip have a width of at least 8 mm and the strip has a thickness that is at least double the thickness of the at least one inner layer.

A transparent conductive film includes a transparent insulating substrate, a first electrode, and a second electrode, in which a first thin metal wire 38 of the first electrode has a first front surface 38A being directed to the viewing side and having a line width W1A, and a first back surface 38B being directed to the side opposite to the viewing side and having a line width W1B, a second thin metal wire 39 of the second electrode has a second front surface 39A being directed to the viewing side and having a line width W2A, and a second back surface 39B being directed to the side opposite to the viewing side and having a line width W2B, the W1A, W1B, W2A, and W2B are 0.5 to 10 μm, W1A is larger than W1B and W2A is larger than W2B.

The present invention provides for a method and structure for forming three-dimensionally routed dielectric wires between discrete points on the two or more parallel circuit planes. The wires may be freely routed in three-dimensional space as to create the most efficient routing between the two arbitrarily defined points on the two or more parallel circuit planes. Metalizing the outer surfaces of these three dimensional dielectric wires electrically coupling the discrete wires to their respective discrete contact points. Two or more of these wires may be in intimate contact to one another electrically coupling to each other as well as to two or more discrete contact pads. These electrically coupled contact pads may be on opposite sides or on the same side of the structure and the formed metalized wires may originate on one side and terminate on the other or originate and terminate from the same side