H05K1/09

FLEXIBLE ELECTRODE CIRCUIT CAPABLE OF BEING 3D CIRCUIT PRINTED STRAIN SENSOR USING SAME, AND MANUFACTURING METHOD THEREFOR
20230044133 · 2023-02-09 ·

Proposed are a flexible electrode circuit capable of being foamed through 3D circuit printing, a strain sensor using the same, and a manufacturing method thereof. The flexible electrode circuit includes a flexible substrate and an electrode foamed on the flexible substrate. The electrode includes a conductive line layer and a passivation layer. The conductive line layer includes a matrix including an elastic polymer and a conductive line having conductive liquid metal microparticles dispersed in the matrix. The passivation layer includes a coating portion coated on the conductive line and having an elastic polymer.

STRETCHABLE CONDUCTIVE SUBSTRATE
20230042692 · 2023-02-09 ·

A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.

Ground discontinuities for thermal isolation

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

Ground discontinuities for thermal isolation

A quantum mechanical circuit includes a substrate; a first electrical conductor and a second electrical conductor provided on the substrate and spaced apart to provide a gap therebetween; and a third electrical conductor to electrically connect the first electrical conductor and the second electrical conductor. The third electrical conductor is a poor thermal conductor.

CIRCUIT BOARD AND METHODS FOR FABRICATING A CIRCUIT BOARD
20230010064 · 2023-01-12 ·

A method for fabricating a circuit board comprises preparing an elastomeric substrate having a roughened surface. The elastomeric substrate is stretched before an electrically conductive material is electrolessly deposited onto the roughened surface. A suitable amount of electrically conductive material is deposited onto the elastomeric substrate before the elastomeric substrate is released from its stretch.

WATER-REDISPERSIBLE GRAPHENE POWDER
20230012274 · 2023-01-12 ·

The invention described herein provides a dry graphene powder composition comprising pristine graphene flakes, wherein the pristine graphene flakes are non-covalently functionalised with polymeric amphiphilic molecules and wherein the dry graphene powder composition is capable of forming a stable homogeneous dispersion in aqueous or alcoholic media, in the absence of free dispersants or stabilizers, as well as methods for producing same, and the use thereof in graphene inks, for 2D and 3D printing, for production of flexible circuits, electrodes, electrocatalysts, for fabrication of nanocomposites and for wet-spinning of pristine graphene fibers.

METHOD FOR PRODUCING CONDUCTOR, CONDUCTOR PRODUCING APPARATUS, AND STRUCTURE

Embodiments of the present invention provide a method for producing a conductor. The method includes: applying a resin forming composition containing a polymerizable compound and a solvent on a substrate; polymerizing the polymerizable compound in the applied resin forming composition to form a resin structure that is porous on the substrate; and applying a conductor forming composition containing at least one selected from the group consisting of metal oxide particles and metal particles on the resin structure.

METHOD FOR PRODUCING CONDUCTOR, CONDUCTOR PRODUCING APPARATUS, AND STRUCTURE

Embodiments of the present invention provide a method for producing a conductor. The method includes: applying a resin forming composition containing a polymerizable compound and a solvent on a substrate; polymerizing the polymerizable compound in the applied resin forming composition to form a resin structure that is porous on the substrate; and applying a conductor forming composition containing at least one selected from the group consisting of metal oxide particles and metal particles on the resin structure.

Structures with deformable conductors

A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

Nanometric copper formulations

A formulation containing particulate matter including nanometric metallic copper particles, at least 10% of the particulate matter being single-crystal metallic copper particles, the particulate matter having an average secondary particle size (d.sub.50) within a range of 20 to 200 nanometers, the nanometric metallic copper particles being at least partially covered by at least one dispersant; a concentration ratio of crystalline cuprous oxide particles to the nanometric metallic copper particles, within the particulate matter, being at most 0.4; the formulation including a solvent, the particulate matter and the solvent forming a dispersion.