In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

An antenna package according to an embodiment includes a plurality of antenna units including first antenna units and second antenna units, a circuit board electrically connected to the antenna units. The circuit board includes a core layer including a first surface and a second surface facing each other, a first circuit wiring disposed on the first surface of the core layer and electrically connected to the first antenna units, and a second circuit wiring distributed on the first and second surfaces of the core layer and electrically connected to the second antenna units. Antenna units of different resonance frequencies can be efficiently included in the package using the circuit wiring design.

Power control and decoupling capacitance arrangements for integrated circuit devices are discussed herein. In one example, an assembly includes a first circuit assembly comprising a first circuit board coupled to an integrated circuit device, wherein the first circuit board is coupled to first surface of a system circuit board. The assembly also includes a second circuit assembly comprising a second circuit board having one or more voltage adjustment units configured to supply at least one input voltage to the integrated circuit device, wherein the second circuit board is coupled to a second surface of the system circuit board and positioned at least partially under a footprint of the integrated circuit device with respect to the system circuit board.

An energization controller that is easily and inexpensively adaptable to diversified configurations of a load is provided. The energization controller includes a parent board mounted with a mechanical relay that allows or interrupts flow of a current between a power source and a load, a child board mounted with a load control component that drives the load or transmits a signal to the load, and a connecting part that connects the parent board and the child board to each other.

An energization controller that is easily and inexpensively adaptable to diversified configurations of a load is provided. The energization controller includes a parent board mounted with a mechanical relay that allows or interrupts flow of a current between a power source and a load, a child board mounted with a load control component that drives the load or transmits a signal to the load, and a connecting part that connects the parent board and the child board to each other.

A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

A wiring board includes a wiring layer, an insulating layer, a plurality of opening portions, and a connection terminal. The insulating layer is laminated on the wiring layer and covers a wiring pattern. Each of the plurality of opening portions penetrates through the insulating layer to the wiring pattern. The connection terminal is formed on the respective opening portions and comes into contact with the upper surface of the wiring pattern. The wiring layer includes a first wiring pattern, and a second wiring pattern that is formed of a plurality of laminated metal layers and that is thicker than the first wiring pattern. An upper surface of a metal layer serving as an uppermost layer of the second wiring pattern is a contact surface with the connection terminal and has a same width as an upper surface of a metal layer serving as a layer other than the uppermost layer.

A printed circuit board includes: a substrate structure having a first surface including a chip mounting region on which a semiconductor chip is mounted and a second surface opposite to the first surface, the second surface having a rectangular shape having first to fourth edges and first to fourth corners formed by the first to fourth edges, and pad patterns on the second surface of the substrate structure, wherein the second surface includes a first region including a region corresponding to the chip mounting region and in contact with the first to fourth edges, respectively, and second regions adjacent to the first to fourth corners, respectively and spaced apart from each other by the first region, wherein the pad patterns include first pad patterns in the first region and surface-treated with a nickel/gold (Ni/Au) layer, and second pad patterns in the second regions and surface-treated with an organic solderability preservative.

The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

Embodiments of the disclosure provide a via structure, a method for preparing the same and a method for regulating impedance of a via structure. The via structure includes a first via, a second via and a first connecting through hole; and a first metal layer a the second metal layer. The first connecting through hole is located between the first via and the second via, and covers part of the first via and part of the second via. The first metal layer and the second metal layer are respectively located in the first via and the second via. The first metal layer and the second metal layer respectively cover a sidewall of the first via and a sidewall of the second via. The first metal layer is separated from the second metal layer through the first connecting through hole.