A pad configuration adaptable to a display system includes a plurality of input bond pads, via which a driver of the display system is mounted and signals are inputted to the driver; and a plurality of output bond pads, via which the driver is mounted and signals are outputted to a display panel of the display system. Input and output bond pads corresponding to one of two neighboring drivers are point symmetric with input and output bond pads corresponding to the other of the two neighboring drivers.

A circuit board structure includes a circuit substrate, a first circuit layer, and a second circuit layer. The circuit substrate has a surface and includes at least one conductive structure and at least one patterned circuit layer. The conductive structure is electrically connected to the patterned circuit layer, and an upper surface of the conductive structure is aligned with the surface. The first circuit layer is directly disposed on the surface of the circuit substrate and electrically connected to the conductive structure. A line width of the first circuit layer is less than or equal to ¼ of a line width of the patterned circuit layer. The second circuit layer is directly disposed on the first circuit layer and electrically connected to the first circuit layer.

A conductive solder pad for a ball grid array (BGA) includes a concave edge to accommodate a via that exits a substrate at a position at the surface of the substrate that is offset from the solder pad. The offset arrangement of the via and solder pad allow for differential thermal expansion of the substrate material and the via material with reduced risk of cracking or fracturing the solder joint. The concave edge of the solder pad provides a gap from the via to avoid unintended electrical connections while maintaining the solder-joint pitch of the BGA.

An electronic power device including transistors formed on a circuit assembly formed of a plurality of layers. The layers include gate drive layers, gate return layers, and power layers. A gate drive circuit is formed on the circuit assembly, and is connected to the gate and source of each of the transistors through the gate drive layers and the gate return layers. A voltage supply connection is provided to each of the plurality of transistors interleaved through the power layers. The circuit assembly includes a multilayer circuit board and/or a multilayer ceramic substrate. The ceramic substrate includes the power layers and transistors. The gate drive and return layers and gate drive circuit may be formed within the ceramic substrate or the circuit board. The ceramic substrate may be located in a modular housing. The circuit board may be outside the modular housing or inside the modular housing.

A first terminal provided on a tail pad portion includes a base portion, a bent portion and an overlapping portion. The base portion includes a first surface fixed to a base insulating layer and a second surface on an opposite side to the first sur face. The bent portion is reversed in a thickness direction of the base portion from an end of the base portion towards the second surface. The overlapping portion extends from the bent portion in a direction along the second surface. An ansotropic conductive film (ACE) is disposed between the overlapping portion and the second terminal. The overlapping portion and the second terminal are connected to each other via the ACE.

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

A cable includes a wiring assembly with a knuckle and wires bundled together. The cable also includes a connector assembly with a connector having connections for the wires, where the connections are arranged along a longitudinal axis. In some embodiments, the connector assembly captures an end of the wiring assembly, and the knuckle of the wiring assembly is pivotally connected to the connector assembly. In some embodiments, the cable includes circuitry configured to authenticate the cable to a device connected to the cable by the connector and/or to authenticate the device connected to the cable. A control system includes control elements and/or subsystems coupled with a backplane adjacent to one another and cables configured to connect to the control elements and/or subsystems. Wiring assemblies of the cables can articulate to be parallel to each respective connector. Further, each cable can authenticate the cables and/or the control elements or subsystems.

A resource circuit board is configured for use by a physical migration system, the resource circuit board including at least one common interface shaped and configured to connect to an interconnect of a base circuit board; and at least one migration-support interface the at least one common interface being different from the at least one migration-support interface, the at least one migration-support interface: shaped to connect to at least one corresponding migration-support interface of the physical migration system; and configured to provide at least one of power and connectivity to the resource circuit board during a physical migration of the resource circuit board.

A circuit board and a battery connection module are provided. The circuit board has an insulating substrate and a plurality of circuit traces provided thereto. At least one of the traces is provided with a fuse unit. The fuse unit has a main fuse and at least one spare fuse. The main fuse has two main trace connection end portions respectively positioned at two ends of the main fuse and connected to the trace and a main fuse section connected between the two main trace connection end portions. The spare fuse has two trace connection end portions respectively positioned at two ends of the spare fuse and a fuse section connected between the two trace connection end portions, the fuse section and the main fuse section are spaced apart from each other and arranged side by side, and at least one of the two trace connection end portions is not connected with the trace so as to form an electrical disconnection with the trace, and after the main fuse section forms an electrical disconnection, the two trace connection end portions are connected to the trace so that a current conductive path is formed by the spare fuse and the trace.