A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

A electronic device includes: a plurality of substrates each including a substrate main body and a heat generating element, the plurality of substrates being provided side by side in a plate thickness direction; a cooler which is provided between the substrates adjacent to each other, and configured to cool the heat generating element; and a piping which is made of metal, and is connected to the cooler. The piping includes: an inner piping portion which is arranged in an inter-substrate region, and is connected to the cooler; an inner piping extending portion provided so as to extend from the inner piping portion to an outer side of the inter-substrate region; and an outer piping portion which is arranged to be shifted from the inter-substrate region, and is connected to the inner piping extending portion. The outer piping portion includes a movable piping portion that is deformable.

An assembling method for a multi-core cable having a plurality of electrical insulated wires is designed to connect one-end-portions of the electrical insulated wires to electrode patterns, respectively, of one circuit board, correspondingly connect other-end-portions of the electrical insulated wires to electrode patterns, respectively, of the other circuit board, compute intersection coefficients on one end side and the other of the cable, and iterate interchanging connecting destinations for the one-end-portions of the electrical insulated wires, correspondingly interchanging connecting destinations for the other-end-portions of the electrical insulated wires, and computing the intersection coefficients on the one end side and the other of the cable. The connecting destinations for the electrical insulated wires to the electrode patterns are determined in such a manner that a maximum intersection coefficient denoting either larger one of the respective intersection coefficients of the one end side and the other of the cable is made small.

An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.

An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.

An energization controller that is easily and inexpensively adaptable to diversified configurations of a load is provided. The energization controller includes a parent board mounted with a mechanical relay that allows or interrupts flow of a current between a power source and a load, a child board mounted with a load control component that drives the load or transmits a signal to the load, and a connecting part that connects the parent board and the child board to each other.

An energization controller that is easily and inexpensively adaptable to diversified configurations of a load is provided. The energization controller includes a parent board mounted with a mechanical relay that allows or interrupts flow of a current between a power source and a load, a child board mounted with a load control component that drives the load or transmits a signal to the load, and a connecting part that connects the parent board and the child board to each other.

A telematics device includes a housing, and first and second circuit boards. An electronic control unit of the telematics device is arranged on the first circuit board. At least one antenna of the telematics device is arranged on the second circuit board. The first circuit board and the second circuit board are arranged together in the housing. The first circuit board and the second circuit board are coupled by means of at least one electrical connecting element.

Disclosed is a flexible PCB RF cable having a ground pattern that is divided into two ground patterns, which are connected through a connection pattern arranged in an area overlapped with a signal line pattern, and thus cracks are minimized during bending. The disclosed flexible PCB RF cable comprises: a signal line pattern interposed between a first dielectric sheet and a second dielectric sheet; first and second lower ground patterns, which are mesh patterns arranged to be spaced from each other below the first dielectric sheet; a lower connection pattern connected to the first and second lower ground patterns; first and second upper ground patterns, which are mesh patterns arranged to be spaced from each other above the second dielectric sheet; and an upper connection pattern connected to the first and second ground patterns.

A system for the assembly of circuit boards is shown. The system includes an assembly device and a circuit board. The assembly device comprises a substantially planar base plate and guide members. The circuit board includes multiple rigid portions connected by flexible members. The guide members extend into a space partially or completely enclosed in the horizontal direction by the circuit board, and determine the position and orientation of the rigid portions relative to the base plate.