A thin film capacitor for which electrode conductivity is high and electrode irregularities are unlikely to be generate even if the capacitor if heated up to 700° C. This thin film capacitor has a first electrode, a dielectric layer, and a second electrode. The dielectric layer contains an ABO.sub.2N-type oxynitride. The nitrogen concentration of the part of the dielectric layer that contacts the first electrode is no more than half the nitrogen concentration of the center part of the dielectric layer.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

To provide a dielectric composition having excellent reliability. The dielectric composition contains a main component represented by a composition formula (Sr.sub.1-xCa.sub.x).sub.m(Ti.sub.1-yHf.sub.y)O.sub.3-δN.sub.δ, in which 0.15<x≤0.90, 0<y≤0.15, 0.90≤m≤1.15, 0<δ≤0.05 are satisfied.

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a die in a first dielectric layer; and a capacitor including a first conductive pillar and a second conductive pillar in the first dielectric layer, each pillar having a first end and an opposing second end, where the first and second conductive pillars form a first plate of the capacitor; a second dielectric layer on the die and on the second end of the first and second conductive pillars extending at least partially along a first thickness of the first and second conductive pillars and tapering from the second end towards the first end; and a metal layer on the second dielectric layer, wherein the metal layer extends at least partially along a second thickness of the first and second conductive pillars, where the metal layer forms a second plate of the capacitor.

Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.

Systems and methods of additively manufacturing passive electronic components are provided. An additive manufacturing device may deposit a material to create a passive electronic component. A sensor may continuously measure an electrical property of the passive electronic component across two electrical contacts as the material is deposited during manufacturing. The sensor may transmit the measured electrical property to a processor whereby the processor may adjust a material deposition rate of the additive manufacturing device. The continuous measurement of the electrical property and adjustment of the material deposition rate as the passive electronic component is produced allows for passive electronic components to be manufactured to a high degree of accuracy of the electrical property.

A capacitor packaging having a central termination and three or more capacitors (or groups of capacitors) arranged about the central termination. The electrical flow paths between the termination and the capacitors or groups of capacitors are of substantially the same length. The capacitors or groups of capacitors may be arranged in a generally circular pattern with the termination centered on the center. The termination may include first and second terminals. The capacitors may be mounted to a printed circuit board (“PCB”) with traces on opposite surfaces of the PCB providing electrical flow paths from the terminals to opposite legs of the capacitors. The capacitor packaging may include a primary PCB with a first circular arrangement of capacitors and a secondary PCB with a second circular arrangement of capacitors. The capacitors may be sandwiched between the PCBs with the second arrangement of capacitors disposed concentrically inwardly of the first arrangement.

The invention relates to a medical device comprising a printable electrical component (1), the printable electrical component (1) comprising a plastic substrate (L1) wherein at least electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from the group comprising polycarbonate, cycloolefin copolymers, polymethylacrylate, polypropylene and wherein the dried conductive ink comprise silver and/or gold, wherein the electrical component (E) comprises feather-like and/or meander-like and/or spiral-shaped sections, whereby the medical device further comprises a fluid line, wherein the printable electrical component is located on the outside of the fluid line. The invention also relates to a medical device comprising a printable electrical component (1) the printable electrical component (1) comprising a plastic substrate (L1), wherein at least one electrical component (E) is applied to the plastic substrate, wherein the electrical component (E) comprises a dried conductive ink, wherein the plastic substrate is selected from a group comprising polycarbonate, cycloolefin copolymers, polymethyl-methacrylate, polypropylene and wherein the dried, conductive ink comprises silver and/or gold, wherein the electrical component (E) comprises at least one conductor section or at least two electrodes, characterized in that the electrical component (E) is part of an expansion sensor and/or a pressure sensor and/or a thermal flow sensor.

Apparatus and methods of automatically trimming a PCB-based LC circuit. The apparatus may comprise an interface to a printed circuit board (PCB). The PCB may include a PCB inductor and a PCB capacitor to form an LC circuit. The LC circuit may have an LC circuit frequency. The apparatus may comprise a variable capacitor communicatively coupled to the interface and configured to adjust an effective capacitance of the LC circuit.

A capacitive level-sensor device, for detecting the level of a medium contained in a container, is configured for being installed on the outside of the container, in a position substantially resting against a wall of the container that is made at least in part of an electrically insulating material. The circuit support has, in a sensing region thereof, at least one first plurality of first capacitive elements, which comprise at least one first array of first electrodes, preferably set at a distance apart from one another along a level-detection axis, the first electrodes being made of an electrically conductive material and being arranged at least in part in a position corresponding to at least one first side of a supporting structure of the circuit support. The first electrodes are covered with at least one insulation or protection layer made of an electrically insulating and sealing material, which is selected from materials that include silicon, or its derivatives or compounds, and materials that include fluorine derivatives or compounds.