H05K1/162

PCB structure for embedding electronic components

A PCB, printed circuit board, structure for forming at least one embedded electronic component. The structure comprises a multi-layer PCB board comprising at least one through-hole via, the via comprising a plurality of electrodes vertically aligned within the via, each electrode comprising a plated ring; and an isolation section separating each of the electrodes.

Apparatus and method for forming sensors with integrated electrical circuits on a substrate

An apparatus is described. The apparatus includes a substrate and one or more sensor components formed on the substrate. And, the apparatus includes one or more electrical circuits formed on the substrate electrically coupled with at least one of the one or more sensor components formed on the substrate.

Electronic device including conductive element and extending element with insulating layer disposed therebetween

The present disclosure provides an electronic device including a substrate, a conductive element, an extending element and an insulating layer. The substrate includes an edge, the conductive element is disposed on the substrate, the extending element is disposed corresponding to at least a portion of the conductive element and extends to the edge of the substrate, and the insulating layer separates the conductive element and the extending element.

Ultra High Surface Area Integrated Capacitor
20230120903 · 2023-04-20 ·

The present invention includes a method of fabricating an integrated RF power condition capacitor with a capacitance greater than or equal to 1 nf and less than 1 mm.sup.2, and a device made by the method.

PLANAR HIGH-DENSITY ALUMINUM CAPACITORS FOR STACKING AND EMBEDDING

Multi-terminal capacitor devices and methods of making multi-terminal capacitor devices are described herein. The multi-terminal capacitor devices may include a plurality of individual capacitors arranged in a single device layer, such as high surface area capacitors. A individual capacitor may include an aluminum foil-based electrode, an aluminum oxide dielectric layer conformal with the aluminum foil-based electrode, and a conductive material electrode, such as a conducting polymer or a conductive ceramic, in conformal contact with the dielectric layer.

Operator Control Unit For a Measuring Instrument For Process or Automation Engineering, and Measuring Instrument Having an Operator Control Unit of This Kind

The invention relates to an operator control unit for a measuring instrument for process or automation engineering, the operator control unit consisting of at least two adjacently arranged control panels (10a), the control panels (10a) being operated by pressing on a respective shape-variable or elastic housing region (2a) having a respective capacitive sensor element (11) disposed thereunder. The sensor elements (11) each have a first electrode (11a) as a lower plate capacitor and a counter-electrode (11b) arranged in parallel thereabove as an upper plate capacitor, and pressing on one of the housing regions (2a) causes the respective upper plate capacitor (11b) to approach the respective lower plate capacitor (11a), thus changing the capacitance. The first electrode (11a) is attached to a first carrier material (12) and the counter-electrode (11b) is attached to a second carrier material (13). According to the invention, the housing regions (2a) are arranged adjacently to one another in an uninterrupted manner, and the sensor elements (11) are parts of a multi-layered composite printed circuit board (100), which bears against the inner sides of the housing regions (2a), wherein the composite printed circuit board (100) comprises at least the first carrier material (12), which consists of a plurality of segments of rigid circuit boards each with flexible intermediate pieces arranged therebetween, and the second carrier material (13) in the form of a conductive layer, which two carrier materials are spaced apart from one another via an interposed plastic layer (15), forming a measuring chamber (17), and wherein the plastic layer (15) has a plurality of interruptions for forming the sensor elements (11) and a decoupling region (16) between the control panels (10a).

CAPACITOR ARRAY
20230120573 · 2023-04-20 ·

The capacitor array that includes: a capacitor layer including a plurality of capacitor portions divided by a plurality of through-portions and arranged in a plane, and the capacitor portions each have a first main surface and a second main surface that are opposite to each other in a thickness direction. The plurality of through-portions include a first through-portion extending in a first direction perpendicular to the thickness direction, and a second through-portion extending in a second direction perpendicular to the thickness direction and intersecting the first direction. In a sectional view, each of the first through-portion and the second through-portion independently has a taper having a width decreasing from one of the first main surface and the second main surface to the other main surface. The first through-portion has a taper angle that is different from a taper angle of the second through-portion.

ELECTRICAL DEVICE COMPRISING AN AC VOLTAGE DIVIDER AND CAPACITORS ARRANGED IN INTEGRATED COMPONENTS
20230060343 · 2023-03-02 ·

An electrical device is provided with an AC voltage divider that includes a board, a plurality of dividing stages each associated with a dividing ratio, an input terminal arranged on the board for receiving an input voltage, and an output terminal arranged on the board for outputting a divided voltage. Moreover, each dividing stage comprises a plurality of capacitors, and for each dividing stage, the plurality of capacitors of the respective dividing stage is arranged in a same integrated component assembled on the board and electrically connected between the input terminal and the output terminal.

SYSTEMS AND METHODS FOR BREAK OUT OF INTERCONNECTIONS FOR HIGH-DENSITY INTEGRATED CIRCUIT PACKAGES ON A MULTI-LAYER PRINTED CIRCUIT BOARD

A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.

Flexible energy storage device
11631544 · 2023-04-18 · ·

The present invention relates to an energy storage device comprising a flexible substrate comprising at least two patterned regions spaced apart from one another along the length of the flexible substrate. Each patterned region comprises at least one groove extending in the longitudinal direction of the substrate (web direction) having a first and a second face, wherein the first and second faces are each coated with a conductor such that there is no direct electrical communication between the conductor on the first and second faces, the at least one groove contains a material for storing electrical potential energy (e.g. capacitive material), the first and the second face of the at least one groove of each patterned region are each in electrical connection with an electrical conductor at opposing edges of the flexible substrate, and the first and the second patterned region are electrically connectable to one another.