A quantum phased array comprising one or more arrays of emitter elements each emitting one or more particles having one or more quantum wavefunctions; one or more a phase shifting elements coupled to the emitter elements, each of the phase shifting elements comprising a source of a vector potential applying one or more phase shifts to the one or more quantum wavefunctions; and a control circuit coupled to the one or more phase shifting elements, the control circuit configuring the one or more vector potentials to control an interference of the quantum wavefunctions forming a distribution of the one or more particles at a target, and wherein the distribution is described by a wavefunction interference pattern resulting from the interference controlled by the vector potentials.

A structure for wireless communication having a plurality of conductor layers, an insulator layer separating each of the conductor layers, and at least one connector connecting two of the conductor layers wherein an electrical resistance is reduced when an electrical signal is induced in the resonator at a predetermined frequency. The structure is capable of transmitting or receiving electrical energy and/or data at various near and far field magnetic coupling frequencies.

The present invention provides an integrated antenna and visual display apparatus, or one of an antenna apparatus and visual display apparatus which is integratable with the other. Apertures are formed in a visual display, such as an OLED display. The apertures when formed in a conductive layer operate as radiating bodies of an antenna array. A subset of sub-pixels of the visual display can be removed in line with the apertures. An optically transparent substrate is located over the visual display, and an array of further conductive elements, which may be optically transparent, is disposed on an exterior of this substrate. The further conductive elements operate to direct the antenna signals through the substrate, by coupling in an impedance-matched manner with the radiating apertures.

A package comprising a substrate, a first integrated device coupled to a first surface of the substrate, and a second integrated device coupled to a second surface of the substrate. The substrate includes a dielectric layer and a plurality of interconnects. The plurality of interconnects includes a first plurality of interconnects configured as a first inductor and a second plurality of interconnects configured as a second inductor. The first integrated device is configured to be coupled to the first inductor. The second integrated device is configured to be coupled to the second inductor. The second integrated device is configured to tune the first inductor through the second inductor.

Electrical circuitry is produced on the surface of an organic polymer. The electrical circuitry is produced on a support, and a polymerizable composition is brought into contact with the support and the circuitry. The polymerizable composition is polymerized while in contact with support and the circuitry to produce a solid, organic polymer. The electrical circuitry becomes adhered to and partially embedded in a surface of the solid organic polymer. The support may be removed subsequent to the polymerization step to expose the circuitry at the surface of the solid organic polymer.

A semiconductor composite device is provided that includes a voltage regulator, a package board, and a load, and converts an input DC voltage into a different DC voltage to supply the converted DC voltage to the load. The VR includes a semiconductor active element. The package board includes a C layer in which a capacitor is formed, and an L layer in which an inductor is formed. A plurality of through holes penetrate the C layer and the L layer in a direction perpendicular to the mounting face in the package board. The capacitor is connected to the load through the through hole. The inductor is connected to the load through the through hole and to the VR through the through hole.

A multilayer coil component includes a multilayer body formed by stacking a plurality of insulating layers and including a coil built therein, and first and second outer electrodes electrically connected to the coil. The coil is formed by electrically connecting a plurality of coil conductors stacked together with the insulating layers. The multilayer coil component further includes, inside the multilayer body, first and second connecting conductors. The first connecting conductor connects between a portion of the first outer electrode covering the first end face, and a coil conductor facing the portion. The second connecting conductor connects between a portion of the second outer electrode covering the second end face, and a coil conductor facing the portion. Concerning the length direction, the first and second connecting conductors each have a length from about 2.5% to about 7.5% of the length of the multilayer body.

A module substrate antenna includes: a laminate in which a plurality of ferrite layers are stacked; antennal coils provided on surfaces of the respective ferrite layers; a connection pad connected to an external circuit; and a lead wire provided between the laminate and the connection pad. In the laminate, the antenna coils are two types of the antenna coils, and the two types of the antenna coils are alternately stacked.

A flexible circuit board includes liquid crystal polymer (LCP) layers and metal layers including circuit routes. Each of the LCP layers includes via structures. The metal layers and the LCP layers are alternatively stacked to form a multi-layer structure. Adjacent metal layers are electrically connected through the via structures. Some via structures of different LCP layers are substantially aligned with one another to form a stack of via structures. Each of the via structures includes openings filled with conductive material. The size of the opening fulfils the following equation: Vb≥cos(Bh/Vh)*Vt/k*2, where Vb is a diameter of a smaller aperture, Vt is a diameter of a bigger aperture, Vh is a combined thickness of a LCP layer and a metal layer, Bh is a thickness of a LCP layer and k is a tensile modulus.

A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.