A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment a package substrate comprises a glass core, and a vertically oriented inductor embedded in the glass core. In an embodiment, the inductor comprises vertical vias through the glass core, and where the vertical vias are electrically coupled together by conductive traces over a surface of the glass core to provide a plurality of conductive turns.

An assembly includes an electromagnetic coil with a conductor, and a substrate on which the conductor is arranged. The coil has a core and the conductor extends around the core. The core is formed by a ferromagnetic rivet that is fastened to the substrate.

An electronic device in provided, including an antenna using a horn structure capable of using at least a portion of a metal member as a signal waveguide structure of the antenna. The device includes a housing, a display, a printed circuit board, and at least one wireless communication circuit, where a waveguide hole is provided to connect at least a portion of a through hole and an electronic component and is used as an operating channel of the electronic component together with the waveguide hole.

An RFID tag substrate includes an insulating substrate that has a mounting region in which a semiconductor device is disposed, the mounting region being included in a first surface of the insulating substrate, and a coil that is positioned at an outer edge portion of the insulating substrate. The coil includes a plurality of first coil conductors and a plurality of second coil conductors that are wound such that the first coil conductors and the second coil conductors each have the same number of turns and such that a direction in which the first coil conductors are wound and a direction in which the second coil conductors are wound are opposite to each other. The first coil conductors and the second coil conductors are alternately arranged in a thickness direction of the insulating substrate and connected in series to one another.

An antenna module comprises: a circuit board, having a three-dimensional keep-out area; an antenna, disposed on the circuit board and located in the keep-out area; and a metal piece, disposed on the circuit board and located in the keep-out area, wherein the metal piece is electrically insulated from the antenna.

A wiring device including a first printed circuit board (PCB) that includes a first direct current (DC) output port and a second DC output port. The wiring device further includes a second PCB electrically connected with the first PCB, the second PCB including a planar transformer integrated with a surface of the second PCB and configured to output power at one or more DC voltage levels, a switch connected to the planar transformer, and a microcontroller. The microcontroller includes an electronic processor and is configured to control delivery of power from the planar transformer to at least one of the first DC output port and the second DC output port using the switch. The switch may have a Gallium Nitride (GaN) chemistry or a Silicon Carbide (SiC) chemistry.

Various embodiments of the present disclosure relate to power conversion using a planar transformer assembly that provides medium-voltage isolation at high frequencies. A planar transformer comprises primary and secondary planar windings configured to generate an isolated output. Each primary and secondary winding is interleaved on layers of a printed circuit board using one or more vias within the layers of the printed circuit board. The planar transformer also comprises a magnetic core and a field-shaping apparatus coupled with the printed circuit board. The field-shaping apparatus is configured to shape an electric field generated by the windings. The primary windings can be coupled to a DC source via switching devices while the secondary windings can be coupled via switching devices to one or more DC ports followed by AC inverters configured to generate three single-phase AC outputs for medium voltage applications.

A substrate includes a multilayer substrate body in which a plurality of circuit bodies are laminated in a laminating direction through insulating layers and are interlayer connected via a connected conductor formed on each of the insulating layers, and a magnetic body that is arranged in the laminating direction while at least a part of or all of the magnetic body sandwiches the circuit bodies. Each of the circuit bodies includes at least a first circuit body and a second circuit body. The first circuit body is formed of a first extending portion and a first folding portion. The second circuit body is formed of a second extending portion and a second folding portion.

The present invention relates to a hybrid movable coil plate and a flat panel speaker, and more particularly, to a hybrid movable coil plate and a flat panel speaker which have improved acoustic pressure of the speaker by attaching a coil pattern printed on one surface of the movable coil plate and a copper wire coil wound on the other surface to increase inductive electromotive force. A hybrid movable coil plate for a flat panel speaker is characterized by including a spirally wound copper wire coil attached on one surface thereof and a PCB coil pattern-printed on the other surface thereof, wherein the copper wire coil and the PCB coil are formed in track shapes, a pair of lead wire connection ends are formed, and copper foils are formed in one or more via holes for electrical connection between the copper wire coil and the PCB coil, and in the vicinity of at least one among the one or more via holes.