A method for manufacturing a circuit board with nickel resistor embedded therein provides a copper substrate, the copper substrate includes a copper foil. A nickel resistance layer is formed on the copper foil. A first dielectric layer and a first copper layer are formed on the nickel resistance layer. The copper foil and the first copper layer are etched to form a first conductive wiring layer and a second conductive wiring layer respectively, the nickel layer not being subjected to an etching process, to obtain the finished circuit board.

Aspects of the disclosure relate to apparatus and methods for producing a downhole electrical component, having steps of providing a non-conductive polymer substrate, establishing an active area on the non-conductive polymer substrate, patterning the active area on the non-conductive polymer substrate with a conductive material through an additive manufacturing process and incorporating the patterned non-conductive polymer substrate into a final arrangement.

A multilayer wiring substrate and a module having the multilayer wiring substrate, wherein the multilayer wiring substrate has a capacitor with a capacitance value smaller than that of the conventional one. The substrate includes a core substrate and capacitors installed therein. At least one of the capacitors is a first capacitor which includes a lower electrode, a dielectric layer, and an upper electrode. The lower electrode is located closer to the core substrate than the dielectric layer and the upper electrode are. The upper electrode is located farther away from the core substrate than the dielectric layer and the lower electrode are. The lower electrode is entirely disposed on the core substrate. The upper electrode has a first portion and a second portion. The first portion overlaps the dielectric layer and the lower electrode to serve as the first capacitor. The second portion extends from the first portion.

The force sensing dome switch is configured to simultaneously, or nearly simultaneously, close or open two separate circuits. For one of these circuits, the force sensing dome switch acts as a variable resistor whose value is controlled by applied force. Each force sensing dome switch is disposed upon a printed circuit board (PCB) comprising two separate circuits. An example force sensing dome switch comprises: a conductive dome in conductive contact with a first trace of a first circuit, the conductive dome is configured to make conductive contact with a second trace of the first circuit when pressed down; and a force-sensing resistor element positioned between the PCB and the conductive dome, the force-sensing resistor element overlays a pair of traces of a second circuit and is configured to conductively connect the pair of traces when pressed against the PCB by the conductive dome. The force-sensing resistor element is a layer of material whose resistance changes when force is applied.

A heater for an aerosol-generating device is provided, the heater including: a flexible electrically insulating substrate including a first portion, a second portion, and a fourth portion, in which the flexible electrically insulating substrate is rolled into a tube; control electronics disposed on the first portion of the flexible electrically insulating substrate; a heating element including an induction coil and being disposed on the second portion of the flexible electrically insulating substrate; and a susceptor element arranged on the fourth portion of the flexible electrically insulating substrate. An aerosol-generating device is also provided, including a cavity to receive an aerosol-generating article including an aerosol-forming substrate, and the heater. A system is also provided, including the aerosol-generating device and the aerosol-generating article including the aerosol-forming substrate.

Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

A method for making a via (3) in a carrier layer (1) made of a ceramic comprising:

providing the carrier layer (1),

realizing a passage recess (2) in the carrier layer (1),

at least partially filling the passage recess (2) with a paste (3), and

performing a bonding process, in particular an active soldering process or a DCB process, for bonding a metallization (5) to the carrier layer (1), the via (3′) being realized from the paste (3) in the passage recess (2) when the bonding process is performed.

A low-voltage varistor includes a cured body of a resin composition for forming the low-voltage varistor. The resin composition includes: (A) at least one selected from carbon nanotubes and carbon aerogels; and (B) at least one selected from epoxy resin and acrylic resin.

In some examples, a touch screen includes resistors between the touch electrodes and routing traces. In some examples, the resistors can include a transparent conductive material included in the touch electrodes of the touch screen. The resistors can be located in a border region of the touch screen that can surround an active area of the touch screen that can include the touch electrodes and display pixels of the touch screen, for example. In some examples, the resistors included in the touch screen can have different resistances from each other and the same outer dimensions as one another. The resistors can reduce the variation in resistance from channel to channel in the touch screen, which can improve touch screen performance, for example.

A multi-layer printed circuit board (PCB) includes a laminate between a PCB heating core and a PCB signal core. The PCB heating core includes an electrically conductive resistive heating element upon a first core substrate. During a lamination cure PCB fabrication stage, a platen contacts the PCB and a power supply is electrically connected to the resistive heating element. The laminate is cured with heat transferred by the platen and heat from the resistive heating element. The PCB heating core may be located within an inner layer of the multi-layer PCB to normalize a thermal gradient across the multi-layer PCB that may otherwise occur during the laminate cure fabrication stage. As a result of the normalized thermal gradient, the degree of laminate cure and material characteristics of the cured laminate material are more consistent throughout the multi-layer PCB thickness.