An electronic device such as a voice-controlled speaker device may have a housing characterized by a vertical longitudinal axis. A flexible substrate such as a flexible mesh substrate with component support regions coupled by flexible segments may be wrapped around the housing and the vertical axis. The housing may have surface regions with compound curvature. The flexible substrate may conform to the regions with compound curvature. A fabric spacer layer may be interposed between the flexible substrate and the housing. Electrical components such as input-output devices may be mounted to the component support regions. A display may be formed from an array of light-emitting devices that are mounted on respective component support regions. Light from the light-emitting devices may pass through the fabric spacer layer toward the housing and back out away from the housing. An outer fabric layer may cover the mesh.

The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.

The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

An electronic device is provided. The electronic device includes a housing and a display including a transparent plate forming a front of the electronic device, a display panel viewable from the front of the electronic device through the transparent plate, a panel flexible circuit film arranged under the rear surface of the display panel including a bending part that extends toward the front surface of the display panel in a region adjacent to a first side surface of the electronic device, the bending part being electrically connected to the display panel on the front surface of the display panel, and a first support member arranged between the rear surface of the display panel and the panel flexible circuit film, a partial region of the first support member having an area larger than that of the panel flexible circuit film within a designated distance from the first side surface.

A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, Pb Se, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.

A display apparatus includes a display panel having an image acquisition region within a display area, and an image acquisition device over a side of the display panel opposing to its display surface. The image acquisition device is at a position corresponding to the image acquisition region, and is configured to capture an image based on lights from an outside pattern over a side of the display panel proximal to the display surface. The display panel includes a substrate and a plurality of light-emitting elements over the substrate. The plurality of light-emitting elements comprises one or more first light-emitting elements positionally within the image acquisition region. At least one first light-emitting element includes a non-transparent electrode provided with at least one through-hole configured to allow the lights from the outside pattern to pass through the display panel.

An electronic device includes: a main body to which a rotating shaft is rotatably connected; a driving motor, provided on the main body, connected to the rotating shaft and configured to drive the rotating shaft to rotate; a flexible display screen, having a first side edge connected to the rotating shaft and capable of completely rolling the flexible display screen onto the rotating shaft or expanding the rolled-up flexible display screen, under a reciprocating rotation of the rotating shaft; and a sucking apparatus provided on the main body and configured to suck the electronic device onto a surface of a carrier.

A circuit board that has flexibility owing to an organic insulating layer and that still has high adhesion between metal wiring and the organic insulating layer; and a method for producing the circuit board without employing photolithography. The circuit board comprising a metal wiring arrangement portion and a metal wiring non-arrangement portion, wherein: in the metal wiring arrangement portion, metal wiring, a first diffusion layer, and a first organic insulating layer are stacked; in the metal wiring non-arrangement portion, a metal oxide layer, a second diffusion layer, and a second organic insulating layer are stacked; the metal wiring is made of a first metal element; and the first diffusion layer contains the first metal element and a second metal element.

A display device includes a display panel, a back cover disposed on a rear surface of the display panel and including a plurality of layers, and a finishing portion disposed to surround at least a part of an outer side surface of the display panel and an outer side surface of the back cover. The back cover includes a first layer positioned on the rear surface of the display panel and disposed in an area including an area overlapping with the display panel, a second layer disposed apart from the first layer to oppose the first layer, and a core disposed between the first layer and the second layer.

A touch sensor module according to an embodiment of the present invention includes a touch sensor layer including a visual area, a bending area and a pad area, a flexible circuit board electrically connected to the touch sensor layer on the pad area of the touch sensor layer, supporting structure covering the touch sensor layer on the bending area, and an optical layer disposed on the visual area of the touch sensor layer. The optical layer partially covers the supporting structure on a portion of the bending area adjacent to the visual area.