A printed wiring board includes a resin insulating layer, via conductors formed in the resin insulating layer, metal posts formed on the via conductors, respectively, and a solder resist layer formed on the resin insulating layer such that the metal posts have lower portions embedded in the solder resist layer and upper portions exposed from the solder resist layer, respectively. The metal posts are formed such that each of the metal posts has a top portion having a diameter in a range of 0.8 to 0.9 times a diameter of a respective one of the lower portions of the metal posts.

A method of manufacturing a ceramics-metal bonded body according to the present invention is a method of manufacturing a ceramics-metal bonded body in which a metal layer is bonded to at least one surface of a ceramics substrate, and comprises: a groove-forming step of forming a groove extending across a bonding region of a ceramics substrate to which a metal layer is bonded; and a bonding step of, after the groove-forming step, forming a metal layer by stacking, in the bonding region of the ceramics substrate, a metal plate of an aluminum or aluminum alloy with a thickness of less than or equal to 0.4 mm, via an Al—Si based brazing material foil, and bonding the metal plate to the bonding region by heating while applying load in a stacking direction.

A printed circuit board is provided. The printed circuit board includes an insulating material, and a circuit comprising a first region that partially penetrates the insulating material, and a second region formed on the first region and that protrudes from an upper portion of the insulating material, the first region includes a first electroplating layer and a first electroless plating layer that are formed between the insulating material and the first electroplating layer.

The present disclosure provides a printed circuit board and a method thereof. The printed circuit board has a first substrate, at least one first trace layer and at least one second trace layer. The first substrate has a first surface and a second surface. The first surface and the second surface are corresponding to each other along an axis. The first trace layer is formed on the first surface and/or the second surface of the first substrate. The first trace layer has at least one first trace and at least one first gap beside the first trace by etching. The second trace layer is formed on the first trace layer. The second trace layer has at least one second trace and at least one second gap beside the second trace by etching.

The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

A circuit board is formed from a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and blanket surface plasma etch operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.

A sensor package that is configured by molding a frame to a mounting substrate by insert molding and that prevents adhering to components and terminals and reduces damage to the mounting substrate. The sensor package includes an image sensor, a mounting substrate to which the image sensor is mounted, a frame provided in the mounting substrate so as to surround the image sensor, and a cover attached to the frame so as to cover the image sensor. The mounting substrate includes terminals electrically connected with the image sensor and a groove provided in a predetermined depth between an area in which the frame is provided and the terminals.

An electronic device and a method for manufacturing the same are disclosed. The method for manufacturing the electronic device includes the following steps: providing a substrate; forming a metal layer on the substrate, wherein the metal layer has a first surface; forming a first insulating layer on the first surface of the metal layer; forming a second insulating layer on the first insulating layer; etching the first insulating layer and the second insulating layer to form a contact hole, wherein the contact hole exposes a portion of the first surface; cleaning the portion of the first surface exposed by the contact hole with a solution; and forming a transparent conductive layer on the second insulating layer, wherein the transparent conductive layer electrically connects with the metal layer.

First, a router (400) is rotated about a shaft (406) to cause a tip end (402) of the router (400) to move in a vertical direction with respect to a conductive layer (130) while being in contact with the conductive layer (130). In this way, the router (400) is inserted into the conductive layer (130) to form an opening in the conductive layer (130). Next, the router (400) is rotated about the shaft (406) to cause a side surface (404) of the router (400) to move in a horizontal direction with respect to the conductive layer (130) while being contact with the conductive layer (130). In this way, the conductive layer (130) is formed into a conductive pattern (132).