Methods, systems, devices, and products for constructing a downhole tool electronics module. Methods may include creating a circuit board by metallizing at least part of a first surface on a first side of a substrate to define at least one metallized area on the first surface, wherein the substrate comprises a ceramic material and includes: the first side, including at least (i) the first surface, and (ii) an elevated surface elevated from the first surface, and a second side opposite the first side; flattening at least partially the elevated surface to a predefined first flatness to create a mounting portion by removing material from the elevated surface; attaching an electronics component to the first surface; and mounting the circuit board on an electronics carrier by adhering at least part of the mounting portion to a mounting surface on the electronics carrier. Flattening at least partially the elevated surface to the predefined first flatness may be carried out by removing the material by areal grinding.

A printed circuit board includes a first insulating layer; a protective filler layer disposed on one surface of the first insulating layer; a first wiring layer disposed on the one surface of the first insulating layer and having a pad protruding with respect to the protective filler layer; a first via passing through the first insulating layer and contacting the pad; and a second insulating layer disposed on the first wiring layer and the protective filler layer, and having a cavity exposing the pad and at least a portion of the protective filler layer, respectively.

A process for making a circuit board modifies a catalytic laminate having a resin rich surface with catalytic particles dispersed below a surface exclusion depth. The catalytic laminate is subjected to a drilling and resin-rich surface removal operation to expose the catalytic particles, followed by an electroless plating operation which deposits a thin layer of conductive material on the surface. A photo-masking step follows to define circuit traces, after which an electro-plating deposition occurs, followed by a resist strip operation and a quick etch to remove electroless copper which was previously covered by photoresist.

A printed circuit board includes: a first insulating material; and a second insulating material disposed on one surface of the first insulating material, and including first and second cavities having depths different from each other. At least one groove portion is disposed in a side surface of each of the first and second cavities.

A method for producing a waveguide in a multilayer substrate involves producing at least one cutout corresponding to a lateral course of the waveguide in a surface of a first layer arrangement comprising one or a plurality of layers. A metallization is produced on surfaces of the cutout. A second layer arrangement comprising one or a plurality of layers is applied on the first layer arrangement. The second layer arrangement comprises, on a surface thereof, a metallization which, after the second layer arrangement has been applied on the first layer arrangement, is arranged above the cutout and together with the metallization on the surfaces of the cutout forms the waveguide.

A dividing groove forming device includes: a first cutter including a plurality of first rotary blades; a second cutter including a plurality of second rotary blades; a first rotation drive unit for rotationally driving the first cutter; a second rotation drive unit for rotationally driving the second cutter; a cutter support unit; and a phase adjustment unit. The cutter support unit supports the first cutter and the second cutter such that the first and second cutters are radially opposed to each other so that rotation axes of the first and second cutters are parallel to each other. The phase adjustment unit adjusts a phase of at least one of the first cutter and the second cutter such that the first rotary blades and the second rotary blades are opposed to each other in an opposing area in which the first cutter and the second cutter are opposed to each other.

This anisotropic conductive sheet includes: an insulating layer having a first surface and a second surface; and a plurality of conductive paths which are disposed so as to extend in the thickness direction inside the insulating layer and which are respectively exposed to the outside of the first surface and the second surface. The circumferential surface of the conductive paths includes a region where the surface area ratio represented by equation (1) is at least 1.04. Equation (1): surface area ratio = surface area / area

The present disclosure relates to a flexible printed circuit board (FPCB) and a method for manufacturing a flexible printed circuit board, which is capable of minimizing a process tolerance generated when an outer shape of a board is processed by forming a reference mark in the FPCB and performing an outer shape processing by using the reference mark as a reference point among a series of processes for manufacturing the board.

To improve, in an encapsulated circuit module having a metal shield layer covering a surface of a resin layer containing filler, a shielding property of the shield layer against electromagnetic waves.

The encapsulated circuit module has a substrate 100 on which electronic components are mounted, covered with a first resin 400. A surface of the first resin 400 is covered with a shield layer 600 including a first metal covering layer 610 made of copper or iron and a second metal covering layer 620 made of nickel. Each of the first metal covering layer 610 and the second metal covering layer 620 is thicker than 5 μm.

A fingerprint sensor package includes a substrate, a fingerprint sensor chip, and a flexible printed circuit board (FPC). The substrate includes a first portion and a second portion. A line layer is disposed on the first portion. The fingerprint sensor chip is disposed on the substrate. The fingerprint sensor chip is electrically connected to the FPC by the line layer. The package is simple, reliable, and easy for manufacturing process, reducing materials and processing costs.