A ceramic substrate of the present disclosure is a ceramic substrate including a ceramic body having a ceramic layer on a surface thereof and a surface electrode placed on a primary face of the ceramic body. Between the surface electrode and the ceramic layer is an oxide layer made of an insulating oxide having a melting point higher than the firing temperature for the ceramic layer. The oxide layer also extends on the ceramic layer not occupied by the surface electrode. The oxide layer on the ceramic layer not occupied by the surface electrode has a rough surface.

A printed circuit board package structure includes a substrate, plural ring-shaped magnetic elements, a support layer, and first conductive layers. The substrate has two opposite first and second surfaces, first ring-shaped recesses, and first grooves. Each of the first ring-shaped recesses is communicated with another first ring-shaped recess through at least one of the first grooves, and at least two of the first ring-shaped recesses are communicated with a side surface of the substrate through the first grooves to form at least two openings. The ring-shaped magnetic elements are respectively located in the first ring-shaped recesses. The support layer is located on the first surface, and covers the first ring-shaped recesses and the first grooves. The support layer and the substrate have through holes. The first conductive layers are respectively located on surfaces of support layer and substrate facing the through holes.

A circuit board in which damage to an electrode is reduced or a light-emitting device in which damage to an electrode is reduced is manufactured. A method for manufacturing the circuit board or the light-emitting device includes the following steps: preparing a processing member including a circuit and a terminal electrode over a first substrate, a separation layer over the terminal electrode, a bonding layer over the separation layer, and a second substrate over the bonding layer; forming a groove in the processing member using a blade capable of cutting processing by being rotated; and removing part of the separation layer, part of the bonding layer, and part of the second substrate to expose part of the terminal electrode.

A printed circuit board and an electronic component-embedded substrate including the same are provided. The printed circuit board includes a first insulating layer, a second insulating layer disposed on the first insulating layer, a barrier layer disposed between the first and second insulating layers, a cavity penetrating through one of the first and second insulating layers, and a first wiring layer at least partially in contact with the barrier layer. The barrier layer has a modulus lower than a modulus of each of the first and second insulating layers.

A laser processing apparatus disclosed in the present application includes: an optical deflection unit capable of changing a deflection direction of and outgoing energy of an incoming laser pulse by changes of a frequency of and an amplitude of a driving signal to be supplied; and a control unit configured to supply driving signals with amplitudes corresponding to respective frequencies. In a laser processing apparatus configured to process a workpiece by leading outgoing laser pulse of the optical deflection unit to the workpiece and irradiating the workpiece with the laser pulse, as the amplitude corresponding to each of the frequencies, the control unit supplies an amplitude having the ratio that is close to the lowest ratio among ratios of the outgoing energy with respect to the incoming energy of the laser pulse at an amplitude having the largest outgoing energy of the optical deflection unit.

The invention relates to a method for producing a printed circuit board—cooling body structure and such a printed circuit board—cooling body structure, in particular for arrangement in a lighting device of a vehicle, the method comprising at least the following steps: providing a base plate; coating a carrier side of the base plate with an insulation layer and/or with a solder resist; fitting the carrier side with at least one electronic component and applying cooling rib bodies to a cooling side of the base plate opposite the carrier side.

An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

The present disclosure relates to a transparent substrate including: a resin pattern layer including a plurality of grooves respectively including side surfaces and a bottom surface; and, a conductive layer formed within the grooves, wherein a line width of the conductive layer is 0.1 μm to 3 μm and an average height of the conductive layer is 5% to 50% of a maximum depth of each of the grooves, and a manufacturing method thereof, such that simplicity in a manufacturing process and a consecutive process are enabled, manufacturing costs are inexpensive, and a transparent substrate having superior electrical conductivity and transparency characteristics is manufactured.

According to one aspect, an apparatus includes a substrate, a conductor, and a contact pad. The substrate has a first edge, and the conductor is formed on the substrate. The contact pad has a first end and a second end, and is formed on the substrate and connected to the conductor at the first end. The contact pad has a non-uniform configuration, the non-uniform configuration including a first width and a second width, the first width and the second width being measured with respect to a common axis, the first width being wider than a second width, the second width being a width of the contact pad at the second end, the second end being coincident with the first edge.

A PCB having multiple stacked layers laminated together. The laminated stack includes regular flow prepreg and includes a recessed cavity, a bottom perimeter of which is formed by a photo definable, or photo imageable, polymer structure, such as a solder mask frame, and a protective film. The solder mask frame and protective film protect inner core circuitry at the bottom of the cavity during the fabrication process, as well as enable the use of regular flow prepreg in the laminated stack.