[Object] Provided is an aqueous treatment agent having a satisfactory environmental safety and aqueous solution stability, with which satisfactory surface modification properties are obtained for various molded articles and the like.

[Solving Means] An aqueous treatment agent including an imide group-containing compound derived from an imide group-containing compound obtained by partially hydrolyzing a polyimide molded article; a fluororesin-containing aqueous dispersion liquid; and an amine compound, in which an incorporation amount of a fluororesin included in the fluororesin-containing aqueous dispersion liquid is adjusted to a value within the range of 0.1 to 10,000 parts by weight, in terms of solid content, with respect to 100 parts by weight of an imide group-containing compound included in the imide group-containing compound.

The printed wiring board of the present disclosure includes: a plurality of insulating layers laminated in a thickness direction; a plurality of wiring conductors respectively correspondingly positioned between the plurality of insulating layers; a through hole penetrating the plurality of insulating layers and the plurality of wiring conductors in the thickness direction; and a through-hole conductor positioned on a wall surface of the through hole; each of the plurality of wiring conductors has a first surface facing the through hole, each of the plurality of insulating layers has a second surface facing the through hole, and the first surface is farther away from a central axis penetrating the through hole in the thickness direction than the second surface.

An asymmetric electronic substrate and method of making the substrate includes forming a first layer on each opposing major surface of a removable carrier layer, the first layer being a routing layer, simultaneously laminating the first layers, and building up subsequent layers on layers previously formed and laminated on the removable carrier layer iteratively. The subsequent layers including routing layers and a core layer formed on each side of the removable carrier layer, the core layer including through holes having a larger gauge than through holes included in the routing layers. A number of layers on a first side of the core layer, between the core layer and the carrier layer, is different than a number of layers on a second side of the core layer. The carrier layer is removed to produce two asymmetric substrates, each asymmetric substrate including one of the at least one core layers.

Disclosed is a method of manufacturing a wiring board, which allows a desmearing process to be carried out appropriately without roughening a surface of an insulating layer. The method of manufacturing a wiring board includes a light irradiation step for irradiating a wiring board material with ultraviolet light in an atmosphere containing oxygen. The wiring board material has an insulating layer laminated on a conductive layer, a protective layer formed on the insulating layer, and a through hole (viahole) that penetrates the insulating layer and the protective layer. The method also includes a plating step for forming a plating layer, which is made from a conductive material, on the surface of the wiring board material from which the protective layer has been removed. The surface of the wiring board material includes a bottom of the through hole.

A method of manufacturing a printed circuit board or a subassembly thereof comprises the following steps: providing at least two elements (1, 3) of insulating material coupling or connecting the elements (1, 3) of insulating material on at least one adjacent side surface covering the elements (1, 3) of insulating material with a layer (4) of conductive material on at least one surface building up at least one further layer (5, 6, 7, 8) of the printed circuit board (10) at least partly on the elements (1, 3) of insulating material,
wherein the elements (1, 3) of insulating material are made of insulating material having different mechanical, chemical or physical properties.

Furthermore a printed circuit board (10) or sub-assembly thereof is provided.

Provided is a cured body that can enhance the adhesion between an insulating layer and a metal layer, and can reduce the surface roughness on a surface of the insulating layer. The cured body according to the present invention is a cured body of a resin composition that includes an epoxy compound, a curing agent, an inorganic filler, and a polyimide, in which the content of the inorganic filler is 30% by weight or more and 90% by weight or less in 100% by weight of the cured body, the cured body has a sea-island structure having a sea part and an island part, the island part has an average long diameter of 5 m or less, and the island part contains the polyimide.

A printed circuit board according to an embodiment of the present invention includes a base film having an insulating property and a conductive pattern disposed on at least one surface of the base film. The conductive pattern includes a copper particle bond layer which is fixed to the base film, and a lightness L* of a conductive pattern non-formed region of the base film is 60 or less. The base film may include a modified layer on one surface side thereof.

The method for producing a printed wiring board according to the present invention with use of a metal-clad laminated sheet including a metal foil laminated on each of both surfaces of an insulating resin base material, the method at least including: a step (1) of irradiating a predetermined position in a surface (A) of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (A); and a step (2) of irradiating a predetermined position in a surface (B), located in the opposite side to the surface (A), of the metal-clad laminated sheet with a laser to provide a via hole leading to the metal foil in a surface opposite to the surface (B).

A glass substrate includes a first surface and a second surface that are opposite to each other. Multiple through holes pierce through the glass substrate from the first surface to the second surface. Each of five through holes randomly selected from the multiple through holes includes a first opening at the first surface and a second opening at the second surface. The approximate circle of the first opening has a diameter greater than a diameter of the approximate circle of the second opening. The first opening has a roundness of 5 m or less. Perpendicularity expressed by P=t.sub.c/t.sub.0 ranges from 1.00000 to 1.00015, where P is the perpendicularity, t.sub.c is the distance between the center of the approximate circle of the first opening and the center of the approximate circle of the second opening, and t.sub.0 is the thickness of the glass substrate.

A method for fabricating a printed circuit, comprising: darkening a surface location of a conductive material with one or more ultrafast pulses of laser radiation and ablating the conductive material at the surface location with one or more longer duration pulses of laser radiation to produce traces or micro via patterns on the surface of a PCB. A hole for a blind micro via is produced by ablating the conductive material at the darkened surface location with one or more longer duration pulses of laser radiation and cleaning a second conductive material under the substrate with one or more further longer duration pulses of laser radiation.