The electronic module including a metal base, a ceramic substrate, and a die-capacitor is disclosed. The ceramic substrate is mounted on the metal base via eutectic solder. The ceramic substrate includes a main substrate having a back surface facing the metal base and a front surface opposite to the back surface, and a back metal layer placed on the back surface of the main substrate and joined to the eutectic solder. The die-capacitor is mounted on the front surface of the ceramic substrate along one edge of the ceramic substrate. The back surface of the ceramic substrate is provided with an exposure region where the back metal layer is not provided. The exposure region includes a main region corresponding to an outer shape of the die-capacitor spreading along the front surface and an edge region extending from the main region to the one edge of the ceramic substrate.

The disclosure relates to an arrangement with a power module including power semiconductor components. The arrangement further includes a component having a curved surface. The power module is arranged on the curved surface of the component and is non-positively detachably connected to the component. The disclosure also relates to a power converter with the arrangement and to a vehicle with a power converter.

A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).

A copper/ceramic bonded body includes: a copper member (12) made of copper or a copper alloy; and a ceramic member (11) made of nitrogen-containing ceramics, the copper member (12) and the ceramic member (11) being bonded to each other, in which a Mg solid solution layer in which Mg is solid-soluted in a Cu matrix is formed at a bonding interface between the copper member (12) and the ceramic member (11), an active metal nitride layer (41) containing a nitride of one or more active metals selected from Ti, Zr, Nb, and Hf is formed on a ceramic member (11) side, and a thickness of the active metal nitride layer (41) is set to be in a range of 0.05 μm or more and 1.2 μm or less.

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

An electronics module (100), especially a power electronics module, comprising a metal-ceramic substrate (1) serving as a carrier and having a ceramic element (10) and a primary component metallization (21), an insulation layer (40) directly or indirectly connected to the primary component metallization (21), and a secondary component metallization (22) which is connected to the side of the insulation layer (40) facing away from the metal-ceramic substrate (1) and is especially isolated from the primary component metallization (21) using the insulation layer (40), wherein the ceramic element (10) has a first size (L1, D1) and the insulation layer (40) has a second size (L2, D2) and a ratio of the second size (L2, D2) to the first size (L1, D1) has a value smaller than 0.8, to form an island-like insulation layer (40) on the primary component metallization (21).

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

In an insulating circuit substrate, aluminum sheets formed of aluminum or an aluminum alloy are laminated and bonded to a surface of a ceramic substrate and, in the aluminum sheets, Cu is solid-solubilized at a bonding interface with the ceramic substrate and a ratio B/A between a Cu concentration A mass % at the bonding interface and a Cu concentration B mass % at a position of 100 μm in a thickness direction from the bonding interface to the aluminum sheets side is 0.30 or more and 0.85 or less.

A substrate includes electrically-conductive tracks. A semiconductor chip is arranged on the substrate and electrically coupled to selected ones of the electrically-conductive tracks. Containment structures are provided at selected locations on the electrically-conductive tracks, where the containment structures have respective perimeter walls defining respective cavities. Each cavity is configured to accommodate a base portion of a pin holder. These pin holders are soldered to the electrically-conductive tracks within the cavities defined by the containment structures. Each containment structure may be formed by a ring of resist material configured to receive solder and maintain the pin holders in a desired alignment position.

A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.