A circuit board includes a rigid board including a first wiring layer formed on its upper surface side, and a flexible board including a base material having flexibility and disposed on an upper surface side of the first wiring layer, a second wiring layer formed on the base material, and a via wiring formed in a through-hole passing through the second wiring layer and the base material. The via wiring has a protrusion protruding from an upper surface of the second wiring layer, and extending on the upper surface of the second wiring layer positioned on an outer circumferential side of the through-hole.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.

A method and apparatus for manufacturing a composite structure having integrated electronics. A flexible electronic substrate is heated with the flexible electronic substrate positioned relative to a composite laminate. A vacuum is applied to cause the flexible electronic substrate to conform to and bond to the composite laminate, thereby forming an electronic composite panel.

An object of the present invention is to provide a thermosetting material capable of forming a reinforcing member with which a flexible printed circuit board can be reinforced at a level high enough to prevent, for example, detachment of components even without using a reinforcing metal plate, which increases the thickness of an electronic device or the like. The present invention relates to a thermosetting material used for reinforcing a flexible printed circuit board. The thermosetting material has a modulus of tensile elasticity (1) of 50 to 2,500 MPa at 25 C. A heat-cured product of the thermosetting material has a modulus of tensile elasticity (2) of 2,500 MPa or more at 25 C.

Provided is a circuit assembly including a heatsink, an insulating sheet that is placed on the heatsink, and a circuit board that is placed on the heatsink via the insulating sheet. The circuit board is fixed to the heatsink by screwing, and a heat conductive member is arranged between insulating sheet and the circuit board.

The present invention relates to a method for preparing a patterned polyimide coverlay on a substrate. The method includes: providing a polyimide dry film including a carrier and a non-photosensitive polyimide layer on the carrier, the non-photosensitive polyimide layer containing (i) a polyimide precursor or soluble polyimide and (ii) a solvent; forming a predetermined pattern in the polyimide dry film; laminating the patterned polyimide dry film onto a substrate in such a manner that the non-photosensitive polyimide layer faces the substrate; and forming a patterned polyimide coverlay by heating.

A method for forming a substrate structure for an electrical component includes placing an electrically insulating laminate on a substrate and applying hot pressure to the electrically insulating laminate by a heatable plate. An average temperature of a surface temperature distribution within a center area of the heatable plate is higher than 80 C. during applying the hot pressure. Further, an edge area of the heatable plate laterally surrounds the center area and a temperature of the heatable plate within the edge area decreases from the center area towards an edge of the heatable plate during applying the hot pressure. A temperature at a location located vertically above an edge of the substrate during applying the hot pressure is at least 5 C. lower than the average temperature of the surface temperature distribution within the center area.

Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.

A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left there between.