Disclosed herein are devices comprising stretchable 3D circuits and methods for fabricating the circuits. The fabrication process includes providing in the elastomeric polymer as a substrate and providing conductive interconnects within the substrate encased in an insulating polymer, such as polyimide, to provide a stiffness gradient between the conductive interconnects and the flexible elastomeric substrate. The circuit may be fabricated as a multilayer construction using three-dimensional pillars as vias and as external interconnects to the circuit.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A wiring board includes: a substrate first elastic modulus including a first surface and second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member second elastic modulus greater than the first elastic modulus and including a first reinforcing part positioned on the first surface side of the substrate or on the second surface side of the substrate and partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface including pluralities of peaks and valleys aligned along a planar direction of the first surface of the substrate.

Provided is a method for manufacturing a substrate for flexible printed wiring board, comprising a laminated body forming step and an integration step, wherein in the laminated body forming step, on an upper surface and a lower surface of a fluororesin layer having a modified surface, a first and second reinforcing resin layers having a coefficient of thermal expansion smaller than that of the fluororesin layer are respectively stacked through a first thermosetting adhesive, on the first reinforcing resin layer and/or the second reinforcing resin layer, a conductor layer is stacked through a second thermosetting adhesive, to form a laminated body, and in the integration step, the laminated body is heated and integrated at a temperature not lower than a curing temperature of the first and second thermosetting adhesives and lower than a melting point of the fluororesin layer.

Example embodiments described in this disclosure are generally directed to a mounting bracket for deployment in a vehicle. In one embodiment, a multilayer mounting bracket includes a first layer made of a dual-conductive polymer and a second layer made of a polymer that includes an endothermic blowing agent. The dual-conductive polymer includes carbon material that renders the first layer electrically conductive and also includes graphite material that renders the first layer thermally conductive. The endothermic blowing agent renders the second layer thermally insulative. An electronic module such as an engine controller can be mounted upon the first layer, which operates as a heat sink to dissipate heat generated by the electronic module and also operates as an electromagnetic interference (EMI) shield. The second layer prevents heat from being transferred from the first layer into another electronic module that may be mounted upon the mounting bracket.

A method for manufacturing a detector for sensing, detecting and monitoring environmental hazards and conditions, said method including the printing of an electronic circuit on at least a first side of a flexible, printable substrate; coupling at least two electronic components to the electronic circuit on at least the first side of the flexible, printable substrate; thermoforming the flexible, printable substrate to form at least one detection zone from: (i) at least one side of the flexible, printable substrate having an angle for emitting one of a light or a signal from at least one electronic component; and (ii); at least one side of the flexible, printable substrate having an angle for receiving one of a light or a signal by at least one electronic component; and encapsulating the flexible, printable substrate, forming a detector.

Provided are a device and method for molding an FPC and a plastic part, which belongs to the field of FPC processing technology. The method for molding an FPC and a plastic part includes preprocessing a preform and connecting an FPC to the outer cylindrical surface of the preform; and forming a coating on the outer cylindrical surface of the preform by using the device for molding an FPC and a plastic part.

Example embodiments described in this disclosure are generally directed to a mounting bracket for deployment in a vehicle. In one embodiment, a multilayer mounting bracket includes a first layer made of a dual-conductive polymer and a second layer made of a polymer that includes an endothermic blowing agent. The dual-conductive polymer includes carbon material that renders the first layer electrically conductive and also includes graphite material that renders the first layer thermally conductive. The endothermic blowing agent renders the second layer thermally insulative. An electronic module such as an engine controller can be mounted upon the first layer, which operates as a heat sink to dissipate heat generated by the electronic module and also operates as an electromagnetic interference (EMI) shield. The second layer prevents heat from being transferred from the first layer into another electronic module that may be mounted upon the mounting bracket.

Medical apparatus includes a flexible insertion tube having a distal end configured for insertion into a cavity in a body of a living subject and containing a lumen passing through the insertion tube to the distal end. An inflatable balloon is deployable from the distal end of the insertion tube and configured to be inflated by passage of a fluid through the lumen while the probe is deployed in the cavity in the body. At least one flexible circuit substrate is attached to a surface of the inflatable balloon. One or more electrodes, which include a conductive material disposed on an outer side of the at least one flexible circuit substrate, contact tissue in the cavity in the body when the balloon is inflated. A spiral conductive trace is disposed on the at least one flexible circuit substrate.

The present invention is directed to flexible conductive articles (600) that include a printed circuit (650) and a stretchable or non-stretchable substrate (610). In some embodiments, the substrate has a printed circuit on both sides. The printed circuit contains N therein a porous synthetic polymer membrane (660) and an electrically conductive trace (670) as well as a non-conducive region (640). The electrically conductive trace is imbibed or otherwise incorporated into the porous synthetic polymer membrane. In some embodiments, the synthetic polymer membrane is microporous. The printed circuit may be discontinuously bonded to the stretchable or non-stretchable substrate by adhesive dots (620). The printed circuits may be integrated into garments, such as smart apparel or other wearable technology.