A camera module includes a housing, a lens, an assembly, a terminal, and an electronic component. The housing includes a front surface part, a rear surface part on the opposite side to that, and a side surface part connecting the front surface part and the rear surface part. The lens is exposed from the front surface part. The assembly includes an image sensor and is located on the rear surface part side relative to the lens. The terminal is located at the rear surface part for connection with an outside part. A flexible board includes a part extending from the assembly toward the terminal. The electronic component is mounted on the flexible board.

An electronic assembly and a method of forming an electronic assembly. The electronic assembly including a printed circuit board including a first face, a flexible printed circuit connected to the first face of the printed circuit board, a filler component arranged over a first portion of the first face of the printed circuit board, a housing defining a cavity, wherein the filler component is arranged in the cavity, a channel guide extending from the housing, wherein the flexible printed circuit sits in the channel guide, and a substrate positioned adjacent to a second face of the printed circuit board, wherein the second face opposes the first face.

A flexible circuit board including a substrate with a first side and an opposing second side, wherein the substrate is of a colorless polyimide; first and second circuit patterns formed by deposition of ink on the first and second sides, respectively; at least one opening to interconnect the first and second circuit patterns; and first and second cover layers applied on the first and second circuit patterns, respectively, wherein the first and second cover layers are of a colorless polyimide.

A motor driving device includes a printed board on which a pattern is printed, and a resin board which is formed by molding a resin and on which no pattern is printed, and the printed board is provided on the resin board.

Disclosed herein is a method of forming vias in electrical laminates comprising laminating a sheet having a layer comprising a crosslinkable polymer composition to a substrate wherein the crosslinkable polymer composition has a viscosity at lamination temperatures in the range of 200 Pa.Math.s to 100,000 Pa.Math.s, forming at least one via in the crosslinkable polymer layer by laser ablation; and after the forming of the at least one via, thermally curing the crosslinkable polymer layer. According to certain embodiments the cross linkable polymer composition has a viscosity at lamination temperature of at least 5000 Pa.Math.s. This method yields good lamination results, good via profiles, and good desmear results when such compositions are used and the via is laser ablated before cure.

This wiring board comprises: a substrate having a first elastic modulus and including a first surface and a second surface positioned on the opposite side of the first surface; wiring positioned on the first surface side of the substrate and connected to an electrode of an electronic component mounted on the wiring board; and a reinforcing member having a second elastic modulus greater than the first elastic modulus and at least including a first reinforcing part that is positioned on the first surface side of the substrate or on the second surface side of the substrate and that at least partially overlaps the electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate. The wiring includes a section that does not overlap the reinforcing member when viewed along the normal direction of the first surface and that has a meandering shape section including pluralities of peaks and valleys aligned along an planar direction of the first surface of the substrate.

Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.

Systems and methods are disclosed for integration of an electrically functional structure in an information handling system. An information handling system may include may include a housing including a first housing portion coupled to a second housing portion. The first housing portion may include an electrically functional structure integrated within the first housing portion. The first housing portion may also include a first layer and a structural adhesive applied to the first layer. The first housing portion may further include a second layer and a thermally conductive adhesive applied to the second layer to bond the second layer to the first layer. The first housing portion may also include a PCB layer coupled between a first PCB and a second PCB, the PCB layer bonded to the second layer, and the electrically functional structure includes the first PCB and the second PCB.

A surface-treated copper foil of the present disclosure includes a copper foil substrate, at least one surface of which has a surface treatment coat including at least a roughening-treated surface on which roughening particles are formed. Observation of a cross-section of the surface-treated copper foil with a scanning electron microscope shows that on a surface of the surface treatment coat, a standard deviation of the particle height of the roughening particles is 0.16 m or more and 0.30 m or less, and an average value of the ratio of the particle height to the particle width (particle height/particle width) of the roughening particles is 2.30 or more and 4.00 or less.

An adhesive film according to the present invention includes a resin composition layer (layer A) for an interlayer insulating layer, a thermosetting resin composition layer (layer B), and a support film (layer C), and the layer C, the layer A, and the layer B are sequentially arranged in this order. The layer A is a resin composition which contains a thermosetting resin (a1) and an inorganic filler (b1) having a specific surface area of 20 m.sup.2/g or more, and the mass ratio of the thermosetting resin (a1) to the inorganic filler (b1) is within the range from 30:1 to 2:1. The layer B contains a thermosetting resin composition which is in a solid state at a temperature lower than 40 C. but melts at a temperature of 40 C. or higher but lower than 140 C. Consequently, the adhesive film according to the present invention can solve problems in a laser process and a desmear removal process following the laser process and can form a conductor layer which has a high adhesion strength even on an interlayer insulating layer having a smooth surface-roughened state.