Components, methods of forming components, and methods of assembling components on an electronic device are provided. For example, a method of forming a component includes providing a first substrate having a first surface, a second surface opposite the first surface along a height direction, and an initial thickness from the first surface to the second surface along the height direction; forming one or more vias in the first substrate, each via extending from the first surface to the second surface of the first substrate; depositing one or more conductive pathways on the first surface of the first substrate; plating the one or more vias; disposing a second substrate on the first surface of the first substrate to form a component sandwich; processing the second surface of the first substrate to reduce a thickness of the component sandwich; and forming one or more contact pads on the first substrate.

A manufacturing method of a circuit board structure includes the following steps. A first sub-circuit board having an upper surface and a lower surface opposite to each other and including at least one conductive through hole is provided. A second sub-circuit board including at least one conductive through hole is provided on the upper surface of the first sub-circuit board. A third sub-circuit board including at least one conductive through hole is provided on the lower surface of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are laminated so that at least two of their conductive through holes are alternately arranged in an axial direction perpendicular to an extending direction of the first sub-circuit board. The first sub-circuit board, the second sub-circuit board, and the third sub-circuit board are electrically connected to one another.

The present invention relates to a flexible hybrid substrate for a display and a method for manufacturing the same and, more specifically, to a flexible hybrid substrate for a display, which has a reduced occurrence of cracks, an improved level of flexibility, and can be used in a high-temperature process for manufacturing a display element, and a method for manufacturing the same. To this end, the present invention provides a flexible hybrid substrate for a display and a method for manufacturing the same, the flexible hybrid substrate for a display comprising: an ultra-thin plate glass; a first transparent thin film formed on one surface of the ultra-thin plate glass; and a second transparent thin film formed on the other surface of the ultra-thin plate glass, wherein the second transparent thin film includes a transparent conductive polymer.

One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second maskmirrored image of the first maskto a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.

One variation of a method for fabricating a garment includes: applying a first mask to a first side of a fabric substrate coated with a conductive material; applying a second maskmirrored image of the first maskto a second side of the fabric substrate opposite the first side; applying an etchant to the fabric substrate to remove conductive material outside of the first mask; arranging a conductive interface pad of a component carrier over an electrode defined by remaining conductive material on the fabric substrate, the component carrier including a flexible substrate and a rigid electrical component mounted to the flexible substrate, the conductive interface pad extending from a terminal of the rigid electrical component across a region of the flexible substrate; mechanically fastening the component carrier to the fabric substrate to form a garment insert including an electrical circuit; and incorporating the garment insert into the garment.

An electronic device, in particular for a medical implant, and a printed circuit board arrangement including a printed circuit board, wherein at least one UV-transparent element is at least fixedly coupled to the printed circuit board, wherein the UV-transparent element is intended for fixation of the printed circuit board in an electronic device.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

A power electronic substrate includes a metallic baseplate having a first and second surface opposing each other. An electrically insulative layer also has first and second surfaces opposing each other, its first surface coupled to the second surface of the metallic baseplate. A plurality of metallic traces each include first and second surfaces opposing each other, their first surfaces coupled to the second surface of the electrically insulative layer. At least one of the metallic traces has a thickness measured along a direction perpendicular to the second surface of the metallic baseplate that is greater than a thickness of another one of the metallic traces also measured along a direction perpendicular to the second surface of the metallic baseplate. In implementations the electrically insulative layer is an epoxy or a ceramic material. In implementations the metallic traces are copper and are plated with a nickel layer at their second surfaces.

The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible/stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

A resin composition for printed circuit board contains a resin component containing a thermosetting resin, and an inorganic filler. The inorganic filler contains crushed silica having a specific surface area in a range from 0.1 m.sup.2/g to 15 m.sup.2/g, inclusive, and molybdenum compound particles each having a molybdenum compound in at least a surface layer portion. A content of the crushed silica is in a range from 10 parts by mass to 150 parts by mass inclusive with respect to 100 parts by mass of the resin component.