Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided. A compound is represented by general formula (1): where R.sub.f represents an alkyl group at least part of which is substituted with fluorine, R.sub.O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R.sub.A represents an alkyl group, and R.sub.B represents an alkyl group or a hydrogen atom. ##STR00001##

Provided are a composition for printing for use in a printing method which uses a silicon-based blanket, including: 1) a binder resin, 2) a low boiling point solvent having a boiling point of less than 100 C., 3) a medium boiling point solvent having a boiling point of 100 C. or more and less than 180 C., and 4) a high boiling point solvent having a boiling point of 180 C. or more, wherein the medium boiling point solvent and the high-boiling solvent have a difference in solubility parameter with the binder resin of 3 (cal.Math.cm).sup.1/2 or less, a difference in solubility parameter with the silicon-based blanket of 4 (cal.Math.cm).sup.1/2 or more, and a swelling parameter for the silicon-based blanket of 2 or less, and a printing method using the same.

Methods to mask an RF switch prior to a coating process and RF switches that have been masked according to these methods.

A laminated structure includes metal tracks. In a method for making, a first layer of a first dielectric material is deposited on a substrate. One or more openings are then made in the first layer. A second dielectric material is then deposited within the openings formed in the first layer. The second dielectric material has dielectric properties distinct from the dielectric properties of the first dielectric material.

A circuit board system includes a printed circuit board (PCB) having a first side and a second side opposite the first side. A plurality of plated through holes (PTHs) are defined through the PCB from the first side to the second side. A respective pad is defined at each end of each PTH of the plurality of PTHs. The PCB includes circuit traces electrically interconnecting among the plurality of PTHs for forming PCB circuitry. A coverlay is adhered with an adhesive layer to the first side of the PCB for insulating voltages among the plurality of PTHs.

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.

A method of forming an electronic device on a flexible substrate without using acetone dissolvent, including the steps of: printing a hydrophobic mask on a porous membrane to form a pattern thereon which is complementary to a desired pattern; filtering an aqueous suspension of an electronic material through the non-printed region of the porous membrane, whereby some electronic material is deposited on said non-printed region following the desired pattern; pressing the flexible substrate against the printed face of the membrane in order to transfer the patterned electronic material deposited on the porous membrane to the flexible substrate to form the electronic device thereon.