In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.

Methods to mask an RF switch prior to a coating process and RF switches that have been masked according to these methods.

A method of forming a metallic pattern on a substrate is provided. The method includes applying onto a metallic surface, a chemically surface-activating solution having an activating agent that chemically activates the metallic surface; non-impact printing an etch-resist ink on the activated surface to produce an etch resist mask according to a predetermined pattern, wherein at least one ink component within the etch-resist ink undergoes a chemical reaction with the activated metallic surface to immobilize droplets of the etch-resist ink when hitting the activated surface; performing an etching process to remove unmasked metallic portions that are not covered with the etch resist mask; and removing the etch-resist mask.

A pattern-printed thick film roll and a method for manufacturing the pattern-printed thick film roll can reduce defective products and material loss. The method for manufacturing a pattern-printed thick film roll (5) includes preparing a laminate of a printing substrate film (1) being elongated and comprising resin and a masking film (2) being elongated, comprising resin, having multiple through-holes (2a), and being bonded to a surface of the printing substrate film (1), filling, with ink (32), the through-holes (2a) in the masking film (2) in the laminate of the printing substrate film (1) and the masking film (2) to form an ink film (31), drying the ink film (31) to form a pattern-printed thick film layer (3) having a thickness of 10 to 400 m, and winding a stack (4) including the printing substrate film (1), the masking film (2), and the pattern-printed thick film layer (3) into a roll.

The present disclosure provides a method of manufacturing a conductive pattern and applications thereof, the method including: a step of preparing a laminate including a transparent substrate, a light shielding pattern that is formed on the transparent substrate, and a negative tone photosensitive resin layer that is disposed on the transparent substrate and the light shielding pattern and is in contact with the transparent substrate; a step of irradiating a surface of the transparent substrate opposite to a surface facing the light shielding pattern with light; a step of developing the negative tone photosensitive resin layer to form a resin pattern in a region defined by the transparent substrate and the light shielding pattern; and a step of forming a conductive pattern on the light shielding pattern.

A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.

A photoresist stripper and a method for using the same are provided. The photoresist stripper includes a first stripper and a second stripper. An organic base is absent from the photoresist stripper. The first stripper includes an inorganic base, 1 wt % to 15 wt % of a first azole compound, 2 wt % to 10 wt % of a surfactant, and water. The inorganic base includes potassium hydroxide and sodium hydroxide. The second stripper includes 30 wt % to 80 wt % of an ether alcohol solvent, 1 wt % to 15 wt % of a second azole compound, and water. A concentration of the inorganic base in the first stripper ranges from 30 g/L to 45 g/L.

A printed circuit board comprises a support structure, a conductive layer operably coupled to the support structure, a mask structure formed on the conductive layer, and a cover layer. The conductive layer comprises first and second portions of conductive material separated by a gap that defines a spacing between the first and second portions that does not contain conductive material. The mask structure defines first and second regions on the conductive layer. The first region is enclosed by a first boundary defined by the mask structure and includes the gap. The second region lies outside of the first boundary. The cover layer is sized to fit within the first region and comprises a laminatible insulating material that flows within the first region during lamination. During lamination, the first boundary prevents the laminatible insulating material from flowing into the second region, and the laminatible insulating material flows to fill the gap.

A method of forming a patterned conductive film comprises preparing a wafer for deposition. The method includes forming at least a layer above a substrate and patterning a mask comprising a photoresist material on the layer, where the mask comprises a plurality of openings. A plasma jet printer is used to direct a print head assembly towards an opening within the plurality of openings, where the print head assembly comprises an ink dispenser comprising a nanoparticle module. Nanoparticles are deposited, where a first portion of the nanoparticles is formed on the layer, and a second portion of the nanoparticles is formed on an uppermost surface of the mask. The wafer is submerged into an aqueous solution and dissolving portions of the photoresist material in contact with the layer to dislocate the second portion of the nanoparticles and leave the first portion of the nanoparticles to form the patterned conductive film.