Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

Hot melt compositions include non-aromatic cyclic (alkyl)acrylates and low acid number waxes. Upon application of actinic radiation, the hot melt compositions cure to form resists. They may be stripped from substrates with high alkaline strippers. The hot melt compositions may be used in the manufacture of printed circuit boards and photovoltaic devices.

A dry film includes a carrier film, a thermosetting resin composition layer, and a photocurable resin composition layer formed between the carrier film and the thermosetting resin composition layer. The thermosetting resin composition layer is formed by applying and drying a thermosetting resin composition. The photocurable resin composition layer is formed by applying and drying a photocurable resin composition. A method of producing a printed writing board includes forming a resin insulation layer which includes a thermosetting resin composition layer and a photocurable resin composition layer on the substrate, in the order of the thermosetting resin composition layer and the photocurable resin composition layer from a surface side of the substrate, patterning the resin insulation layer by photolithographic approach, and patterning the resin insulation layer by laser processing.

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided. A compound is represented by general formula (1): where R.sub.f represents an alkyl group at least part of which is substituted with fluorine, R.sub.O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R.sub.A represents an alkyl group, and R.sub.B represents an alkyl group or a hydrogen atom. ##STR00001##

Methods for filling a recessed feature on a substrate employing metal sequential infiltration synthesis processes are disclosed. The disclosed methods include forming an organic layer within a recessed feature and introducing metal species into the organic layer to allow the formation of a metal seed layer. A bulk metal layer can subsequently be formed from the metal seed layer to fill the recessed feature.

A method for producing a flexible printed wiring board using a photoresist includes placing the photoresist, including a first region and a second region, on a substrate, placing a first photomask including a first light-transmitting portion such that the first light-transmitting portion faces the first region to expose the photoresist through the first light-transmitting portion, and placing a second photomask including a second light-transmitting portion such that the second light-transmitting portion faces the second region to expose the photoresist through the second light-transmitting portion. The first region is adjacent to the second region such that an edge portion of the first region overlaps an edge portion of the second region. The first light-transmitting portion has a linear shape including a first tip having a tapered shape.

An apparatus for exposing a printing plate including at least a front source array of LEDs that emits a radiation field incident on the front side of the plate and a back source array of LEDs that emits a radiation field incident on the back side of the plate. A controller connected to the front source and the back source causes movement of at least the front radiation field relative to the plate fixed on a substrate that receives the printing plate in a fixed configuration between the front source and the back source. The apparatus commences a first exposure step of one side of the plate with one of the sources and then a second exposure step of the opposite side of the plate with the other source, imposing a user-definable time delay (t) between commencing the first exposure step and commencing the second exposure step.

An acrylate based photopolymer with high yellowing resistance, excellent photo sensitivity, high toughness, and high glass transition temperature, methods of preparation and used thereof, and solders comprising the same.