Disclosed is a preparation method for a copper clad laminate comprising: (1) dissolving a polymer in an organic solvent, heating and stirring to obtain a pre-impregnation liquid; (2) impregnating a liquid crystal polymer cloth in the pre-impregnation liquid, and drying to obtain a liquid crystal polymer impregnated cloth; and (3) laminating the liquid crystal polymer impregnated cloth and a copper foil to prepare the copper clad laminate, wherein the polymer in step (1) is at least one selected from the group consisting of fully aromatic polyesteramide, epoxy resin, and polyimide; and the liquid crystal polymer cloth in step (2) is prepared from a liquid crystal polymer having a melting point greater than 280° C., a dielectric constant less than 3.2, and a dielectric loss tangent angle less than 0.0025. The preparation method for the copper clad laminate has a simple preparation process and a low manufacturing cost.

A method of manufacturing a metal-clad laminate and uses of the same are provided. The method comprises the following steps: (a) impregnating a reinforcement material with a first fluoropolymer solution, and drying the impregnated reinforcement material under a first temperature to obtain a first prepreg; (b) impregnating the first prepreg with a second fluoropolymer solution, and drying the impregnated first prepreg under a second temperature to obtain a second prepreg; and (c) laminating the second prepreg and a metal-clad to obtain a metal-clad laminate, wherein the first fluoropolymer solution has a first fluoropolymer, the second fluoropolymer solution has a second fluoropolymer, and the first fluoropolymer and the second fluoropolymer are different.

There is provided a resin composition exhibiting excellent dielectric properties, high adhesion to a low-roughness surface, heat resistance, and excellent water resistance. This resin composition includes (a) a polymer having a polyphenylene ether backbone and a butadiene backbone in one molecule and having at least one selected from the group consisting of a vinyl group, a styryl group, an allyl group, an ethynyl group and a (meth)acryloyl group and at least any one of (b) a polymer including a styrene butadiene backbone and (c) a polymer including a cycloolefin backbone, wherein the content is the component (a) of 15 to 60 parts by weight and the total content of the component (b) and the component (c) is 40 to 85 parts by weight, based on 100 parts by weight of the total content of the component (a), the component (b), and the component (c).

A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 μm, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m.sup.3.

A resin composition includes the following components or a prepolymerized product thereof. (A) 100 parts by weight of a prepolymer and (B) 5 parts by weight to 30 parts by weight of a diallyl bisphenol resin, wherein the prepolymer is prepared by subjecting a reaction mixture to a prepolymerization reaction, the reaction mixture includes a maleimide resin, an amino-modified silicone and cyclohexanone, and relative to a total of 100 parts by weight of the maleimide resin, the amino-modified silicone and the cyclohexanone, the reaction mixture includes 60 parts by weight to 80 parts by weight of the maleimide resin, 15 parts by weight to 30 parts by weight of the amino-modified silicone and 2 parts by weight to 15 parts by weight of the cyclohexanone; the reaction mixture does not include m-aminophenol or p-aminophenol; and the amino-modified silicone has an amino equivalent of 750 g/mol to 2500 g/mol. Moreover, the resin composition described above may also be made into articles such as a prepreg, a resin film, a laminate or a printed circuit board.

Processes for laminating a graphene-coated printed circuit board (PCB) are disclosed. An example laminated PCB may include a lamination stack that may include an inner core, an adhesive layer, and at least one graphene-metal structure. Pressure and heat—which may be applied under vacuum or controlled gas atmosphere—may be applied to the lamination stack, after all materials have been placed. The graphene of the graphene-metal structure is designed to promote high frequency performance and heat management within the PCB.

A laminated film in which a heat-resistant base film and a metal foil are bonded using an adhesive is provided with a barrier layer that prevents chemicals from entering the adhesive layer, between the metal foil and the adhesive layer. The barrier layer is made of a heat-resistant resin similar to that of the base film and has a water absorption rate of 1% or less. The adhesive layer is a silicone-based resin and has a thickness of 40 μm or more after drying.

An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm.sup.2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.
MBF=(maximum Young's modulus−minimum Young's modulus)/(average Young's modulus)  [Formula 1]

One aspect of the present application relates to a resin composition including a modified polyphenylene ether compound having a carbon-carbon unsaturated double bond at a molecular end, a maleimide compound having two or more N-substituted maleimide groups in one molecule, and a liquid styrene-butadiene copolymer having a weight average molecular weight of less than 10000 and having a 1,2-vinyl group.

A method for producing a metal-ceramic substrate with a plurality of electrically conductive vias includes: attaching a first metal layer in a planar manner to a first surface side of a ceramic layer; after attaching the first metal layer, introducing a copper hydroxide or copper acetate brine into a plurality of holes in the ceramic layer delimiting a via, to form an assembly; converting the copper hydroxide or copper acetate brine into copper oxide; subjecting the assembly to a high-temperature step above 500° C. in which the copper oxide forms a copper body in the plurality of holes; and after converting the copper hydroxide or copper acetate brine into the copper oxide, attaching a second metal layer in a planar manner to a second surface side of the ceramic layer opposite the first surface side. The copper body produces an electrically conductive connection between the first and the second metal layers.