Provided is copper foil with a resin layer, the resin layer having excellent adhesion, the copper foil exhibiting low dielectric characteristics, which is suitable for high-frequency applications, the copper foil being capable of exhibiting excellent characteristics of reducing transmission loss. More specifically, a laminate of copper foil and an epoxy resin composition layer is provided, the epoxy resin composition layer being present on at least one surface of the foil, the epoxy resin composition containing an epoxy resin and an acid-modified polyolefin, wherein a test piece composed of the laminate and a prepreg has 90-degree peel strength between the copper foil and the prepreg of 0.6 N/mm or more as measured in accordance with JISC6481, and has a reduction rate of the 90-degree peel strength between the copper foil and the prepreg of 20% or less after immersion of the test piece in boiling water for 2 hours.

A metal-clad laminate includes: an insulating layer; and a metal foil being in contact with at least one surface of the insulating layer. The insulating layer contains a cured product of a resin composition containing a polyphenylene ether copolymer having an intrinsic viscosity of 0.03 to 0.12 dl/g measured in methylene chloride at 25° C. and having an average of 1.5 to 3 specific groups per molecule at its molecular terminal, a thermosetting curing agent having two or more carbon-carbon unsaturated double bonds at its molecular terminal, and a thermoplastic elastomer. The metal foil includes a metal substrate, and a cobalt-containing barrier layer provided on at least a contact surface of the metal substrate, the contact surface being in contact with the insulating layer. The contact surface has a ten-point average roughness Rz of 2 μm or less as a surface roughness.

A curable composition is provided that includes an alkenyl phenol A, an epoxy-modified silicone B, an epoxy compound C other than the epoxy-modified silicone B, and a thermosetting resin E, in which the thermosetting resin E contains one or more selected from the group consisting of a maleimide compound, a cyanate ester compound, a phenolic compound, an alkenyl-substituted nadimide compound, and an epoxy compound.

A film for an electronic substrate according to an embodiment has a moisture-absorption rate of less than 0.3% of the initial weight when immersed in water for 24 hours, and thus is less susceptible than existing films for electronic substrates are to changes in dimension or degradation in electrical characteristics caused by containing moisture according to changes in temperature and humidity. Also, the film for an electronic substrate is equal or superior to existing films in terms of flexibility and physicochemical characteristics, and thus may be applied to the manufacture of laminates with a conductive film such as FCCL and electronic substrates such as FPCB to improve processability, durability, transmission capacity, etc.

Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.

An object of the present invention is to provide a polymer film, in which in a case where a laminate is manufactured by sticking a metal foil to the polymer film, the adhesiveness between the polymer film and the metal foil is excellent, and the performance of suppressing a misregistration of a wiring line formed on the metal foil is excellent even in a case of further laminating a sticking material on the wiring line; and a laminate.

A polymer film including a liquid crystal polymer, in which in a case where an elastic modulus at a position A at a distance of half of a thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus A and an elastic modulus at a position B at a distance of ⅛ of the thickness of the polymer film from one surface toward the other surface of the polymer film is defined as an elastic modulus B in a cross-section along a thickness direction of the polymer film, a ratio B/A of the elastic modulus B to the elastic modulus A is 0.99 or less and the elastic modulus A is 4.0 GPa or more.

The method for producing a laminate having a patterned metal foil includes masking the whole surface of a first metal foil in a laminate having the first metal foil, a first insulating resin layer having a thickness of 1 to 200 μm and a second metal foil laminated in this order, and patterning the second metal foil.

An organic board of the present disclosure has a resin component comprising at least one resin selected from the group consisting of an epoxy resin, a polyimide resin, a phenolic resin, an amino resin, a polyester resin, a polyphenylene resin, a cyclic olefin resin, and a Teflon (registered trademark) resin as the main component, and a non-resin component including at least one of an inorganic filler and a flame retardant, in which the non-resin component is dispersed in the resin component, at least a part of the non-resin component is agglomerated to form an aggregate, a part of the resin component forms a resin material part having a particle shape, the resin material part exists within the aggregate, or the resin component forms a matrix phase surrounding the aggregate, and there are voids at some interfaces between the resin component and the aggregate.

Disclosed is a method for manufacturing an FCCL capable of controlling flexibility and stiffness of a conductive pattern. The method for manufacturing an FCCL (Flexible Copper Clad Laminate) includes: an electroforming step of forming a conductive pattern on a mold for electroforming through electroforming; and a transfer step of transferring the conductive pattern from the mold for electroforming to the bottom of a polymer plastic film, wherein the electroforming process is performed in a plating bath equipped with a first metal, a second metal and a third metal, wherein the first metal is copper (Cu), the second metal serves to add flexibility and is one of tin (Sn), gold (Au), silver (Ag) and aluminum (Al), and the third metal serves to add stiffness and is one of nickel (Ni), cobalt (Co), chrome (Cr), iron (Fe), tungsten (W) and titanium (Ti).

A circuit board structure includes a first sub-board including a plurality of circuit patterns, a second sub-board including a plurality of pads, and a connecting structure layer having a plurality of through holes and including an insulating layer, first and second adhesive layers, and a plurality of conductive blocks. The first adhesive layer is directly connected to the first sub-board. The second adhesive layer is directly connected to the second sub-board. The through holes penetrate through the first adhesive layer, the insulating layer, and the second adhesive layer. The conductive blocks are located in the through holes. An upper surface and a lower surface of each conductive block are respectively lower than a first surface of the first adhesive layer and a second surface of the second adhesive layer relatively away from the insulating layer. Each circuit pattern contacts the upper surface, and each pad contacts the lower surface.