Cable foil tape having random or pseudo-random patterns or long pattern lengths of discontinuous metallic shapes and a method for manufacturing such patterned foil tape are provided. In some embodiments, a laser ablation system is used to selectively remove regions or paths in a metallic layer of a foil tape to produce random distributions of randomized shapes, or pseudo-random patterns or long pattern lengths of discontinuous shapes in the metal layer. In some embodiments, the foil tape is double-sided, having a metallic layer on each side of the foil tape, and the laser ablation system is capable of ablating nonconductive pathways into the metallic layer on both sides of the foil tape.

Structures are described having thin flexible polymer substrates with electrically conductive films on each opposing surface while having high optical transmittance and good optical properties. The structures can have total thicknesses of no more than about 30 microns and good flexibility. Processing approaches are described that allow for the coating of the very thin structures by providing support through the coating process. The structures are demonstrated to have good durability under conditions designed to test accelerated wear for touch sensor use.

Methods of patterning electroless metals on a substrate are presented. The substrate is covered by a blocking reagent. After formation of a catalyst blocking layer on the substrate, portions of the catalyst blocking layer are removed to form a circuit pattern. A catalyst is placed the surfaces of both the catalyst blocking layer and the exposed substrate. The catalyst blocking layer prevents or reduces catalytic activity of the catalyst. Electroless metal plating is performed to plate a metal at the active portions of the catalyst.

A stretchable and transparent electronic structure may generally include a stretchable elastomer layer; optionally, a metal adhesion layer on top of the stretchable elastomer layer; a metal alloying layer on top of the metal adhesion layer; and a liquid metal, wherein the structure is colorless and transparent when viewed under visible light. Methods of making the stretchable and transparent electronic structure are also described.

Coating inkjet-printed traces of silver nanoparticles (AgNP) ink with a thin layer of eutectic gallium indium (EGaIn) increases the electrical conductivity and significantly improves tolerance to tensile strain. This enhancement is achieved through a room temperature sintering process in which the liquid-phase EGaIn alloy binds the AgNP particles to form a continuous conductive trace. These mechanically robust thin-film circuits are well suited for transfer to highly curved and non-developable 3D surfaces as well as skin and other soft deformable substrates.

A printed circuit board can include a substrate layer, a first metal layer disposed over the substrate layer, a core layer disposed over the first metal layer, and a second metal layer disposed over the core layer, where the core layer defines a closed cavity between the first and second metal layers. Optionally, the cavity is filled with air and operates as an antenna.

Disclosed herein are laser scanning systems and methods of their use. In some embodiments, laser scanning systems can be used to ablatively or non-ablatively scan a surface of a material. Some embodiments include methods of scanning a multi-layer structure. Some embodiments include translating a focus-adjust optical system so as to vary laser beam diameter. Some embodiments make use of a 20-bit laser scanning system.

A composite substrate structure includes a circuit substrate, a first anisotropic conductive film, a first glass substrate, a dielectric layer, a patterned circuit layer and a conductive via. The first anisotropic conductive film is disposed on the circuit substrate. The first glass substrate is disposed on the first anisotropic conductive film and has a first surface and a second surface opposite to the first surface. The first glass substrate includes a first circuit layer, a second circuit layer and at least one first conductive via. The first circuit layer is disposed on the first surface. The second circuit layer is disposed on the second surface. The first conductive via penetrates the first glass substrate and is electrically connected to the first circuit layer and the second circuit layer. The first glass substrate and the circuit substrate are respectively located on two opposite sides of the first anisotropic conductive film.

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

Object:

To provide an FPC integrated capacitance switch and a method of manufacturing the same, which allow an FPC portion to have high electrical reliability when used in a bent manner and to have wiring lines to be densely arranged.

Solution:

The FPC integrated capacitance switch includes a transparent flexible substrate (1) including a sensor unit (11) and a tail portion (12), a plurality of electrodes (2) formed on a first main surface (1a) of the transparent flexible substrate (1) and in the sensor unit (11), a plurality of first electrode wiring lines (21), a plurality of second electrode wiring lines (22) arranged and formed in parallel in the tail portion (12) and made of a photoresist including conductive particles, an electromagnetic shield (3) formed on a second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view a region including the plurality of electrodes (2), a pair of first electromagnetic shield wiring lines (31), a pair of second electromagnetic shield wiring lines (32) formed in the tail portion (12) to be arranged in plan view outward of a region including the plurality of second electrode wiring lines (22), the second electromagnetic shield wiring lines (32) being made of a photoresist including conductive particles, and an electromagnetic shield mask (33) formed on the second main surface (1b) of the transparent flexible substrate (1) overlapping in plan view the region including the plurality of second electrode wiring lines (22), the electromagnetic shield mask (33) including a light-shielding metal film.