A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

A method of running a printed circuit board (PCB) trace on a PCB. The PCB comprising a plurality of PCB layers. The method comprising forming a conductive trace on at least one of the plurality of PCB layers; coupling a first portion of the conductive trace to a capacitor formed on at least one of the plurality of PCB layers; coupling a second portion, different from the first portion, of the conductive trace to a conductive material formed within a first via extending through two or more of the plurality of PCB layers; and configurably setting a length of a conductive path of the conductive trace according to a predetermined impedance. The capacitor is separated laterally in a plan view at a first distance from the first via. The length of the conductive trace in the plan view is greater than the first distance. The conductive path of the conductive trace of the length has the predetermined impedance.

First, a router (400) is rotated about a shaft (406) to cause a tip end (402) of the router (400) to move in a vertical direction with respect to a conductive layer (130) while being in contact with the conductive layer (130). In this way, the router (400) is inserted into the conductive layer (130) to form an opening in the conductive layer (130). Next, the router (400) is rotated about the shaft (406) to cause a side surface (404) of the router (400) to move in a horizontal direction with respect to the conductive layer (130) while being contact with the conductive layer (130). In this way, the conductive layer (130) is formed into a conductive pattern (132).

A method for manufacturing a circuit board with embedded conductive circuits includes providing a first circuit substrate having a first support board and a first peelable film, providing a second circuit substrate having a second support board and a second peelable film, providing an insulating layer to obtain an intermediate body, pressing the intermediate body, and removing the first support board, the first peelable film, the second support board, and the second peelable film. The first circuit substrate includes a first circuit layer. The second circuit substrate includes a second circuit layer. The first circuit layer is electrically coupled to the second circuit layer through the insulating layer.

A sensor structure and a method for producing the sensor structure. A base material is applied to a transfer support. The transfer support is arranged on a sensor body, and at least parts of the base material are transferred from the transfer support to the sensor body via local energy input.

The present invention provides a high speed signal fan-out method for BGA and a PCB using the same. The method comprises: providing a printed circuit board (PCB), providing a plurality of vias and signal traces of the vias on the PCB; and providing back-drilled holes for routing of other signal traces at positions corresponding to the vias. The vias are arranged into a plurality of straight lines from an edge to the center of the PCB. The plurality of straight lines each is horizontal or vertical. The signal traces of the vias in a straight line are arranged from high to low or from low to high with respect to routing positions of the vias, and the back-drilled holes of the plurality of vias are arranged in descending or ascending order corresponding to the depths of the back-drilled holes.

It is possible to implement pattern formation and pattern manufacturing that eliminate the necessity of high-cost accurate positioning. A pattern manufacturing apparatus (100) includes a controller (101) and a laser projector (102). The controller (101) controls the laser projector (102) to form a pattern on a pattern forming sheet (130) placed on a stage (140). The laser projector (102) further includes an optical engine (121). The optical engine (121) irradiates the pattern forming sheet (130) with a light beam (122). The stage (140) has a hollow structure not to obstruct the optical path of the light beam (122). The pattern forming sheet (130) includes a light-transmitting sheet material layer and a photo-curing layer applied to the sheet material layer.

A method for manufacturing a wiring board that has a rewiring layer on a surface thereof includes forming an insulating layer on a core substrate, forming a groove, in which a wiring layer of a circuit pattern is to be provided, on the insulating layer, forming a metal seed layer on an exposed face of the insulating layer on which the groove is formed, electrodepositing metal, which is to form the wiring layer, by plating to fill the groove with the metal to form a metal layer on the seed layer, machining the metal layer by a cutting tool to remove the metal layer up to a position not reaching the top of the insulating layer, and performing etching or a CMP process to expose the top of the insulating layer thereby to form the wiring layer in the groove and flatten an exposed face of the wiring layer.

Disclosed is a clinch mechanism for assembling a printed circuit board with electronic components that includes a drive shaft configured to move along a vertical axis, a stationary anvil configured to remain stationary during movement of the drive shaft, a cutter having a cutting tip, and a toggle configured to rotate about a toggle rotation axis that includes an involute gear shaped tooth configured to roll across an involute trapezoidal slot of the cutter in order to impart movement on the cutter relative to the stationary anvil. Movement of the drive shaft along the linear axis is configured to move the cutter relative to the stationary anvil, and to move the cutting tip across the stationary anvil to cut an electronic lead located between the cutting tip and the stationary anvil, and to rotate the toggle about the axis.

The present disclosure describes expansion card interfaces for a printed circuit board and methods of making the same. The methods include forming electrical pads of the expansion card interface on a substrate, and dividing at least one electrical pad into a first portion and a second portion. The resulting expansion card interfaces have the first portion conductively coupled to a circuit on the printed circuit board, and the second portion conductively isolated from the first portion.