A pre-tin shaping system is disclosed. The pre-tin shaping system comprises a base securely holding a circuit board having a pre-tin layer, a heat-press unit having a contact tip, and a movable unit moving the heat-press unit relative to the base. The contact tip is movable to shape the pre-tin layer.

A transparent conductor includes a metallic glass, and a method of manufacturing a transparent conductor includes: preparing a metallic glass or a mixture comprising the metallic glass; and firing the metallic glass or the mixture comprising the metallic glass at a predetermined temperature higher than a glass transition temperature of the metallic glass.

A touch sensor including a first substrate which extends in a first direction and on which first channels may be formed and stretched, a first conductive liquid injected into the first channels, a second substrate which extends in a second direction which intersects with the first direction and on which second channels may be formed and stretched, and a second conductive liquid injected into the second channels.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

A method for manufacturing a structure having at least one microscale feature includes mixing a powdered material with a binder to yield a slurry, shaping the slurry to yield a green device, and sintering the green device to yield the structure.

A method for preparing a micro-nano flexible conductive circuit based on ultrasonic driving of liquid metal comprises the following steps: preparing a mold with a channel pattern and a liquid metal chamber by 3D printing, and adding a well-mixed flexible substrate resin mixture into the mold; then, eliminating bubbles, curing, and stripping from the mold to obtain a bottom-uncovered flexible substrate; covering the bottom of the bottom-uncovered flexible substrate with a base plate to obtain a bottom-covered flexible substrate mold; fixing the bottom-covered flexible substrate mold on a metal fixture table, injecting liquid metal into the liquid metal chamber, allowing an ultrasonic welding machine to come in contact with the fixture table on one side, and applying ultrasound to fill the liquid metal in a channel; and removing the base plate to obtain a liquid metal flexible conductive circuit.

A hybrid mold that is used for forming a wiring structure including wiring and vias connecting pieces of the wiring in different layers to each other, the hybrid mold includes a body made of an optically transparent material, a masking pattern made of an opaque material and disposed on a first surface of the body and a pillar structure including a plurality of pillars made of the optically transparent material and protruding from a second surface of the body, the second surface being opposite to the first surface. The masking pattern has shape and placement corresponding to shape and placement of the wiring when viewed from a direction orthogonal to the first surface, and the plurality of pillars each has shape and placement corresponding to shape and placement of the vias when viewed from the direction orthogonal to the first surface.

There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.