A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Disclosed are an electronic device and another electronic device. The electronic device includes a circuit substrate, a conductive adhesive, a driving element and a first protective layer. The circuit substrate includes a connection pad. The conductive adhesive covers the connection pad. The driving element is arranged on the connection pad, and is electrically connected to the circuit substrate through the conductive adhesive. Another electronic device includes a circuit substrate, a first electronic unit, a second electronic unit, and a first protective layer. The first electronic unit is arranged on the circuit substrate and has two side walls. The second electronic unit is arranged on the circuit substrate and has two side walls. The first protective layer at least surrounds a part of both side walls of the first electronic unit and a part of both side walls of the second electronic unit.

A package for an optical module includes a substrate provided through a side wall in a first direction. The substrate includes a first wiring layer including a first signal terminal, a second signal terminal, and a first ground terminal. The package includes a second wiring layer disposed under the first wiring layer. The second wiring layer includes a first ground pattern and a first insulating layer disposed between the first wiring layer and the second wiring layer, and includes a groove extending along the first direction, the groove being filled with a metal. The groove is provided within the first ground terminal, in a plan view, and the first insulating layer is free of the groove. The first ground terminal is electrically coupled to the first ground pattern through the metal of the groove.

A package for an optical module includes a substrate that includes a first wiring layer, a second wiring layer, and a third wiring layer. The package includes a first insulating layer between the first wiring layer and the second wiring layer, the first insulating layer including first vias. The package includes a second insulating layer between the second wiring layer and the third wiring layer, the second insulating layer including second vias and third vias. Each first vias is provided between a corresponding second via and a corresponding third via. The first vias are arranged at a first interval along a first direction. The second vias are arranged at a second interval along the first direction. Each second vias is disposed at an offset by half of the second interval from the corresponding third via.

A microelectronic device comprises a first microelectronic device structure and a second microelectronic device structure vertically neighboring the first microelectronic device structure. The first microelectronic device structure comprises a first memory array region and a first control logic device region and the second microelectronic device structure comprises a second memory array region and a first control logic device region. A third control logic device region vertically overlies the second microelectronic device structure. The first control logic device region includes sense amplifier devices for the first memory array region. The second control logic device region includes additional sense amplifier devices and sub word line drivers for the second memory array region. The third control logic device region includes additional sub word line drivers for the second memory array region. Related microelectronic devices, electronic systems, and methods are also described.

The present invention comprises an apparatus for manufacturing electronics without PCBs.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

A flexible board includes a flexible resin base material, a conductor pattern on a principal surface of the resin base material and including first and second electrodes electrically separated from each other, a first protective film having lower flexibility than the resin base material and covering a portion of the conductor pattern, and a second protective film having higher flexibility than the first protective film and extending over the principal surface of the resin base material and the first protective film to cover another portion of the conductor pattern. The first protective film is closer to the first and second electrodes on the principal surface of the resin base material than the second protective film. The first protective film includes a first opening exposing a portion of the first electrode and a second opening exposing a portion of the second electrode in planar view.

An electronic device comprising: a body having a first portion and a second portion located below the first portion, wherein a bottom surface of the first portion and a side surface of the second portion forms an opening under the bottom surface of the first portion, wherein at least one portion of an electrode is disposed on the bottom surface of the first portion of the body, and at least one portion of the second portion of the body is disposed in an opening of a circuit board with the electrode being disposed on and electrically connected with the circuit board.