A resin member is formed from a resin material containing filler and an insulating base polymer as a main component. The resin member includes an alignment layer close to a surface of the resin member. The alignment layer includes the filler aligned in the surface direction and the base polymer filling the space between pieces of the filler. The alignment layer includes a carbonized portion that is carbonized matter of the base polymer, contains graphite, and provides electrical conductivity and thermal conductivity.

The present invention discloses a super-flexible high electrical and thermal conductivity flexible base material and a preparation method thereof, wherein the method comprises the steps of: S1. carbonizing and blackleading a polyimide thin film, doping nano-metal to the polyimide thin film, and performing ion implantation and ion exchange; S2. performing plasma irradiation modification treatment on a surface of the material obtained after the step S1 to form a heterogeneous surface layer; and S3. forming a metal conductor layer on the heterogeneous surface layer by physical vapor deposition (PVD) or chemical vapor deposition (CVD), so as to obtain the super-flexible high-ductility high electrical and thermal conductivity flexible base material. The method can obtain the C-C-FPC, C-C-COF or C-C-FCCL flexible circuit base material with super flexibility, high ductility, high electrical conductivity, high thermal conductivity and high frequency performance.

Methods and systems for creating a device having a switch trace are disclosed. The systems and methods described herein may include a device that has a chassis, the chassis having a top and a bottom, at least one antenna affixed to the top of the chassis, a first laser direct structuring-fabricated (LDS) trace, a second LDS trace, and a button, the button connected to the first LDS trace and the top of the chassis, wherein the button is configured to contact the second LDS trace when the button is depressed and complete a circuit between the first LDS trace and the second LDS trace upon contact.

A flake-less molecular ink suitable for printing (e.g. screen printing) conductive traces on a substrate has 30-60 wt % of a C.sub.8-C.sub.12 silver carboxylate and 0.1-10 wt % of a polymeric binder, or 5-75 wt % of bis(2-ethyl-1-hexylamine) copper (II) formate, bis(octylamine) copper (II) formate or tris(octylamine) copper (II) formate and 0.25-10 wt % of a polymeric binder, and balance of at least one organic solvent, wherein the binder has ethyl cellulose, and the ethyl cellulose has an average weight molecular weight in a range of 60,000-95,000 g/mol and a bimodal molecular weight distribution.

The present invention relates to a thermoplastic resin composition for laser direct structuring process, and a molded product comprising the same. In one specific embodiment, the thermoplastic resin composition comprises: approximately 100 parts by weight of a base resin; approximately 0.1-20 parts by weight of an additive for laser direct structuring; and approximately 1-20 parts by weight of an impact modifier, wherein the base resin comprises a polycarbonate resin, a polycarbonate-polysiloxane copolymer and a polyester resin.

A laser activatable polymer composition is provided. The composition contains at least one laser activatable additive and at least one high naphthenic thermotropic liquid crystalline polymer that contains repeating units derived from naphthenic hydroxycarboxylic and/or dicarboxylic acids in an amount of about 10 mol. % or more. The polymer composition exhibits a dielectric constant of about 5 or less as determined at a frequency of 2 GHz.

A method and structure are provided for implementing stub-less printed circuit board (PCB) vias and custom interconnect through laser-excitation conductive track structures. Stub-less printed PCB vias are formed which terminate at desired signal layers by controlled laser excitation without stubs or the need to back-drill to remove such stubs.

A thermally expandable material includes microcapsules and a binder having a conducting property, each microcapsule including a shell having an insulating property, and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have an insulating state with the other capsule.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

The present disclosure relates to a conductive trace precursor composition comprising a metal salt; 3 to 15 weight % of a reducing solvent selected from a lactam and/or a polyol, and water. Where the reducing solvent is 2-pyrrolidinone, the 2-pyrrolidinone is not present in an amount of 5 weight % or in an amount of 7.5 weight % of the conductive trace precursor composition.