Graphene oxide is used as an insulation barrier layer for metal deposition. After patterning and modification, the chemical characteristics of graphene oxide are induced. It can be used as the catalyst for electroless plating in the metallization process, so that the metal is only deposited on the patterned area. It provides the advantages of improving reliability and yield. The metallization structure includes a substrate, a graphene oxide catalytic layer, and a metal layer. It may be widely applied to the metallization of the fine pitch metal of a semiconductor package as well as the fine pitch wires of a printed circuit board (PCB), touch panels, displays, fine electrodes of solar cells, and so on.

Low temperature processes for converting mixtures of metal inks into alloys. The alloys can be dealloyed by etching. A method comprising: depositing at least one precursor composition on at least one substrate to form at least one deposited structure, wherein the precursor composition comprises at least two metal complexes, including at least one first metal complex comprising at least one first metal and at least one second metal complex different from the first metal complex and comprising at least one second metal different from the first metal, treating the deposited structure so that the first metal and the second metal become elemental forms of the first metal and the second metal in a treated structure. Further, one can remove at least some of the first metal to leave a nanoporous material comprising at least the second metal. Precursor compositions can be formulated to be homogeneous compositions.

A tube of elastomeric material for an air conditioning system or for other system which is on-board of a motor-vehicle is intended to be fitted over a metal connecting element and to be locked onto the latter by means of a crimping operation that envisages the clamping around the tube of a metal clamping element. The tube includes at least one body made of polymeric elastomeric material supplemented with carbon-based nanofillers wherein an outer surface with one or more piezo-resistive areas is provided, where the polymeric material supplemented with carbon-based nanofillers has been made locally piezo-resistive by means of laser irradiation. The piezo-resistive areas arranged on the body of polymeric elastomeric material of the tube can be used for verifying the correct execution of the crimping operation.

Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a substrate layer having a surface, wherein the substrate layer includes a photo-imageable dielectric (PID) and an electroless catalyst; a first conductive trace having a first thickness on the surface of the substrate layer; and a second conductive trace having a second thickness on the surface of the substrate layer, wherein the first thickness is greater than the second thickness.

An electronic device of a vehicle part of a motor vehicle includes at least one housing having at least one base surface of the vehicle part and a cover piece attached on the base surface, which in the attached state delimits an almost completely closed cavity, at least one first retaining means of a first surface of the vehicle part through which the housing is fixed in or on the vehicle part, and at least one electronic module including at least one conductor unit and at least one contact means connected with the conductor unit.

A microcapsule includes a shell including a conducting component, and a thermally expandable component contained in the shell and having a property of expanding by heating. The shell is deformable in accordance with expansion of the thermally expandable component when the thermally expandable component is heated.

A method for manufacturing a flexible circuit board is provided. The method for manufacturing a flexible circuit board includes the following steps: providing a carrier substrate, forming a flexible substrate on the carrier substrate, and forming a plurality of circuit strings on the flexible substrate. A flexible circuit board manufactured by the above method is also provided.

Provided is a structure that has highly reliable electroconductive pattern regions, that offers an extremely simple manufacturing process, and that has excellent electrical insulation between the electroconductive pattern regions. This structure (10) having electroconductive pattern regions is provided with a support (11), and, on a surface configured by the support, a layer (14) in which insulation regions (12) containing a copper oxide- and phosphorus-containing organic substance and electroconductive pattern regions (13) containing copper are disposed next to one another. This stack is provided with: a support, a coating layer containing copper oxide and phosphorus and disposed on a surface configured by the support; and a resin layer disposed so as to cover the coating layer.

A method of fabricating a wearable device having one or more integrated electronic components, including providing a substrate having an elastomeric material, at least one metal additive, and/or a carbon source additive; forming electrical circuitry within the elastomeric material by structuring one or more electrically conductive traces and plating the one or more electrically conductive traces; and providing the electrical circuitry with a sensor, wherein the sensor is configured to come in direct contact with skin of an individual.

A microcapsule includes a shell including a conducting component; and a thermally expandable component contained in the shell and having a property of expanding by heating, the shell deforming due to expansion of the thermally expandable component to come in contact with another capsule and have a conducting state with the other capsule.