Disclosed is an ultra-thin composite transparent conductive film, comprising: a transparent substrate; a first UV glue layer disposed on one side of the transparent substrate, pattern-imprinted and cured to form a first grid-shaped groove and a first lead groove, the first grid-shaped groove and the first lead groove being filled with conductive materials to form a first conductive layer and a first lead region respectively, depth of the first grid-shaped groove and the first lead groove being smaller than a thickness of the first UV glue layer; a second UV glue layer disposed on one side of the first UV glue layer away from the transparent substrate and used as a reinforced insulating support layer; and a third UV glue layer disposed on one side of the second UV glue layer away from the transparent substrate, pattern-imprinted and cured to form a second grid-shaped groove and a second lead groove, the second grid-shaped groove and the second lead groove being filled with conductive materials to form a second conductive layer and a second lead region respectively, and depth of the second grid-shaped groove and the second lead groove being not greater than a thickness of the third UV glue layer. The ultra-thin composite transparent conductive film has a simple structure and a simplified and stable preparation process, a reduced preparation cost, and can be used widely.

The present disclosure relates to optical systems and methods of their manufacture. An example system includes a printed circuit board assembly (PCBA) and an image sensor package coupled to the PCBA by way of a plurality of bond members. The system additionally includes a sensor holder coupled to the PCBA. The image sensor package and the sensor holder are coupled to the PCBA so as to minimize thermally-induced stresses in at least one of: the plurality of bond members, the PCBA, the sensor holder, or the image sensor package.

A process for creating wiring on a curved surface, such as the surface of a contact lens, includes the following. Creating a groove or trench in the curved surface. Forming a seed layer on the surface and on the groove. Removing the seed layer from the surface while leaving some or all of it in the groove. Depositing conductive material in the groove. Preferably, the deposited conductive material is thicker than the seed layer.

Provided herein are methods for manufacturing a multilayer circuit structure having embedded circuits and the multilayer circuit structure made thereby. A substrate having at least one existing circuit on the surface is provided, then a dielectric layer is formed to cover the existing circuit. A metal layer is subsequently formed on the dielectric layer. The metal layer is made into a metal mask with a pattern by photoimaging, then the pattern is transferred to the dielectric layer underneath by plasma etching to create multiple trenches and pads at the same time. After vias are made at the pads, a conductive metal is deposited into the trenches and vias to form an embedded trace layer with excess conductive metal in the dielectric layer. The excess conductive metal is removed to obtain a new circuit embedded in the dielectric layer and is coplanar with the surface of the dielectric layer.

A mask structure and a manufacturing method of the mask structure are provided. The mask structure includes a transparent substrate, a patterned metal layer, and a plurality of microlens structures. The patterned metal layer is disposed on the transparent substrate and exposing a portion of the transparent substrate. The microlens structures are disposed on the transparent substrate exposed by a portion of the patterned metal layer and being in contact with the portion of the patterned metal layer.

Provided is a wiring board including a fine-wire pattern made of cured conductive ink formed on a board surface, wherein assuming that two orthogonal directions on the board surface are directions X and Y, a line width of another fine wire that is included in the fine-wire pattern, passes through another point on the board surface not aligned in the direction X but aligned in the direction Y with one intersection where three or more fine wires included in the fine-wire pattern are centered at one spot, and does not form another intersection where three or more fine wires are centered at one spot at said another point is 1.5 times or more a minimum line width of the fine wires included in the fine-wire pattern.

A method for manufacturing an integrated multilayer structure includes obtaining a substrate film having first and second sides, providing at least on the first side one or more first functional features, arranging at least one layer upon at least the first side; removing, at least a portion of the substrate film so that space is released in the structure wherein a detachment-enhancing feature provided to the substrate film is configured to facilitate the removal of the at least a portion of the substrate film such that the adjacent remaining film material, if any, the arranged layer and the one or more first functional features are preserved and preferably remain substantially intact; and providing at least one second functional feature into the space released for use so that the at least one second functional feature operatively connects with at least one of the one or more first functional features.

A component carrier and a method of manufacturing the same are disclosed. The component carrier includes a stack having a plurality of electrically conductive layer structures and a plurality of electrically insulating layer structures and a coax structure with an electrically conductive substantially horizontally extending central trace and an electrically conductive surrounding structure at least partially surrounding the central trace with electrically insulating material in between. The coax structure is formed by material of the layer structures of the stack.

A patterned conductive article 200 includes a substrate 210 including a unitary layer 210-1 and includes a micropattern of conductive traces 220 embedded at least partially in the unitary layer. Each conductive trace extends along a longitudinal direction (y-direction) of the conductive trace and includes a conductive seed layer 230 having a top major surface 232 and an opposite bottom major surface 234 in direct contact with the unitary layer; and a unitary conductive body 240 disposed on the top major surface of the conductive seed layer. The unitary conductive body and the conductive seed layer differ in at least one of composition or crystal morphology. The unitary conductive body has lateral sidewalls 242, 244 and at least a majority of a total area of the lateral sidewalls is in direct contact with the unitary layer.

A display substrate having a transparent electrode and manufacturing method thereof includes a transparent substrate, and a patterned channel is disposed on the transparent substrate; a transparent electrode including a composite material of MXene material and polyvinylpyrrolidone, and the transparent electrode is filled in the patterned channel. The transparent electrode of embodiments of the present disclosure has advantages of high transmittance, high conductivity, great machinability, great substrate affinity, great ductility, etc.