H05K3/14

Method and apparatus for applying a tracing to an expandable device
10993667 · 2021-05-04 · ·

A system for obtaining signals related to electrical activity of the heart of a subject includes a sensing device including an elongate member having a distal end configured for placement within a body lumen of a subject, and a proximal end configured to extend from the subject, an actuation portion carried by the elongate member and configured for placement within the body lumen, the actuation portion having a low-profile state for delivery within the body lumen and an expanded state, and one or more sensors disposed on the actuation portion, each including a contact surface configured to contact an interior wall of the body lumen, wherein the actuation portion is configured to cause the contact surface of each of the one or more sensors to contact a location on the interior wall of the body lumen to provide a signal component for producing one or more electrocardiogram signals.

Transparent semiconductor, light control body, and electronic device

A transparent conductor including a transparent substrate, a first dielectric layer, a metal layer containing silver or a silver alloy as a primary component, a second dielectric layer composed of a semiconductor, and a third dielectric layer of which electrical conductivity is different from that of the second dielectric layer in the order presented, wherein the third dielectric layer-is composed of a conductor.

SYSTEMS AND METHODS FOR SELECTIVELY COATING A SUBSTRATE USING SHADOWING FEATURES
20210039378 · 2021-02-11 ·

Systems and methods for producing electromagnetic devices are provided. The systems and methods allow for an electromagnetic device having both a substrate (e.g., polymer) and conductive material (e.g., metal) to be manufactured without using masks or other outside objects disposed over a surface (e.g., the substrate) onto which the conductive material is deposited. In one exemplary embodiment, the method includes performing additive manufacturing using a polymer to produce a device having a plurality of interconnected walls and a plurality of frequency selective surface elements, and then coating portions of the device with a conductive material. A plurality of shadowing features are formed as part of one or more of the walls to protect the frequency selective surface elements from being coated by the conductive material. Other methods, and a variety of systems that can result from the disclosed methods, are also provided.

Fluid discharge device

In conventional fluid discharge devices, a discharge head used should be increased in size according to increase in size of a workpiece such as silicon wafer. However, if the discharge head increases in length, a deformation amount of a mask used for discharging the fluid on the workpiece increases, thereby the discharging amount varies. Discharging the fluid in a reciprocating manner is performed using a fluid discharging device including a head unit having a width shorter than a length of the workpiece. A suction port having opening portions each having a slit shape are disposed on the both sides of the discharge nozzle in a vicinity of the discharge nozzle.

Lift Printing of Fine Metal Lines
20230422402 · 2023-12-28 ·

A method for circuit fabrication includes defining a locus of a conductive trace to be formed on a circuit substrate. Molten droplets of a metal are ejected from a donor substrate in proximity to the circuit substrate onto the defined locus by a process of laser-induced forward transfer (LIFT), whereby the droplets adhere to and harden on the circuit substrate along a length of the defined locus. After the droplets have hardened, a laser beam is directed toward the defined locus with sufficient energy to cause the metal in the hardened droplets to melt and coalesce into a bulk layer extending along the length of the defined locus.

Lift Printing of Fine Metal Lines
20230422402 · 2023-12-28 ·

A method for circuit fabrication includes defining a locus of a conductive trace to be formed on a circuit substrate. Molten droplets of a metal are ejected from a donor substrate in proximity to the circuit substrate onto the defined locus by a process of laser-induced forward transfer (LIFT), whereby the droplets adhere to and harden on the circuit substrate along a length of the defined locus. After the droplets have hardened, a laser beam is directed toward the defined locus with sufficient energy to cause the metal in the hardened droplets to melt and coalesce into a bulk layer extending along the length of the defined locus.

Evaporation apparatus for depositing material on a flexible substrate and method therefore
11058010 · 2021-07-06 · ·

An evaporation apparatus (100) for depositing material on a flexible substrate (160) supported by a processing drum (170) is provided. The evaporation apparatus includes: a first set (110) of evaporation crucibles aligned in a first line (120) along a first direction for generating a cloud (151) of evaporated material to be deposited on the flexible substrate (160); and a gas supply pipe (130) extending in the first direction and being arranged between an evaporation crucible of the first set (110) of evaporation crucibles and the processing drum (170), wherein the gas supply pipe (130) includes a plurality of outlets (133) for providing a gas supply directed into the cloud of evaporated material, and wherein a position of the plurality of outlets is adjustable for changing a position of the gas supply directed into the cloud of evaporated material.

TRANSPARENT SEMICONDUCTOR, LIGHT CONTROL BODY, AND ELECTRONIC DEVICE
20200400991 · 2020-12-24 · ·

A transparent conductor including a transparent substrate, a first dielectric layer, a metal layer containing silver or a silver alloy as a primary component, a second dielectric layer composed of a semiconductor, and a third dielectric layer of which electrical conductivity is different from that of the second dielectric layer in the order presented, wherein the third dielectric layer-is composed of a conductor.

BIDIRECTIONAL SELF-HEALING NEURAL INTERFACE AND MANUFACTURING METHOD THEREOF

Provided is a bidirectional neural interface having excellent elasticity and electrical conductivity improved by deformation, and further having self-healability and a method of manufacturing the same. The bidirectional neural interface includes a first elastic substrate, a neural electrode disposed on the first elastic substrate and including a conductive polymer composite, and a second elastic substrate disposed on the neural electrode, wherein the conductive polymer composite includes a matrix formed of a self-healing polymer material, and a plurality of electrical conductor clusters distributed in the matrix, wherein each of the electrical conductor clusters includes particles of a first electrical conductor, and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor and having smaller sizes than sizes of the particles of the first electrical conductor.

BIDIRECTIONAL SELF-HEALING NEURAL INTERFACE AND MANUFACTURING METHOD THEREOF

Provided is a bidirectional neural interface having excellent elasticity and electrical conductivity improved by deformation, and further having self-healability and a method of manufacturing the same. The bidirectional neural interface includes a first elastic substrate, a neural electrode disposed on the first elastic substrate and including a conductive polymer composite, and a second elastic substrate disposed on the neural electrode, wherein the conductive polymer composite includes a matrix formed of a self-healing polymer material, and a plurality of electrical conductor clusters distributed in the matrix, wherein each of the electrical conductor clusters includes particles of a first electrical conductor, and a plurality of particles of a second electrical conductor formed of the same material as that of the first electrical conductor, distributed around each of the particles of the first electrical conductor and having smaller sizes than sizes of the particles of the first electrical conductor.