A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer device of the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

Disclosed is a novel timer module. The novel timer module includes a replaceable movement, a master control circuit board, an upper housing, and a lower housing. A circuit board is disposed inside the replaceable movement. Five first inserting pins are welded on the circuit board. The first inserting pins are exposed from the outside of a housing of the replaceable movement. The master control circuit board is located in the upper housing and the lower housing, and is fixed on an upper surface of the lower housing. A relay is disposed inside the master control circuit board. Contacts of the relay respectively extend and are fixed on a surface of the master control circuit board by using leads. Therefore, a problem that a conventional timer movement is fixedly welded on a circuit of a timer module can be resolved.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

A flexible cable jumper structure and manufacturing method thereof. The flexible cable jumper device of the present disclosure includes a cover layer, a first metal layer stacked on the cover layer and having a circuit pattern formed thereon, a first dielectric layer stacked on the first metal layer, a first adhesive layer applied on the first dielectric layer, a second metal layer stacked on the first dielectric layer to which the first adhesive layer is applied and having a circuit pattern formed thereon, a heat-resistant layer stacked on the second metal layer, and a terminal layer formed in one region of the heat-resistant layer and electrically connected to the first metal layer and the second metal layer.

A printed circuit board assembly includes a main printed circuit board including a first main signal line and a first dielectric having a first permittivity; a sub printed circuit board including a first sub signal line and a second dielectric having a second permittivity smaller than the first permittivity; and a first connection block configured to connect the first main signal line of the main printed circuit board and the first sub signal line of the sub printed circuit board.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

The present disclosure relates to an electronic unit including at least one component and a printed circuit board, wherein the at least one component has at least one terminal, wherein the printed circuit board has at least one first contact surface and at least one second contact surface, wherein the at least one first contact surface and the at least one second contact surface are spaced apart from one another, wherein the at least one terminal is joined to the at least two contact surfaces by at least one solder joint. The present disclosure further relates to a method for testing at least one state of an electronic unit.

An electronic assembly contains a circuit board having a current-conducting current path with two mutually spaced-apart current path ends that form an interruption point and a contact clip bridging the interruption point. The contact clip is manufactured without a preload, as a thermal fuse. The contact clip has a multiple bent, open clip loop and a contact limb making contact with both mutually spaced-apart current path ends using solder. The contact clip further has a fixing limb with a limb end seated in a circuit board opening. The limb end of the fixing limb is oversized relative to a circuit board opening, and a deformation being imparted to the contact clip, with an internal preload being generated.

A method for modifying an elongate structure including providing a fluid deposited onto the substrate, the fluid containing a dispersion of electrically polarizable nanoparticles and applying an AC voltage across a portion of the elongate structure so as to cause an alternating electric current to pass through the narrow section such that a break in the elongate structure is formed at the narrow section, the break being defined between a first broken end and a second broken end of the elongate structure, and then cause, when the break is formed, an alternating electric field to be applied to the fluid such that a plurality of the nanoparticles contained in the fluid are assembled to form a continuation of the elongate structure extending from the first broken end towards the second broken end so as to join the first and second broken ends.

The multilayer structure including a substrate film and a number of functional components and/or integrated circuits, including at least one first conductive element, at least one second conductive element, and at least one subsidiary conductive element, optionally traces, provided upon the substrate film. The substrate film has been provided with at least one coupling location enhancement element at a coupling location with respect to the substrate film, wherein at said coupling location the coupling location enhancement element is configured to provide an electrical connection between the first conductive element and second conductive element, further wherein said coupling location enhancement element is configured to inhibit coupling between the first conductive element and the subsidiary conductive element at the coupling location and between the second conductive element and the subsidiary conductive element at the coupling location.