A tool for reforming printed circuit board backplane connector pins on a rod control system. The pin reforming tool of this invention is aligned into a card cage using existing card guides and locates itself around the backplane connector. The tool uses a uniquely designed die (that can be set up for one or multiple pin applications) that precisely engages into the connector and around the pin or pins to be reformed, with the assistance of a zig zag alignment guide matched specifically for the pin spacing. A consistent reforming force is applied via a force applicator structured to provide a force of a preselected magnitude.

An electronic assembly (100) includes a mechanical carrier (102), a plurality of integrated circuits (104A, 104B) disposed on the mechanical carrier, a fan out package (108) disposed on the plurality of integrated circuits, a plurality of singulated substrates (112A, 112B) disposed on the fan out package, a plurality of electronic components (114A, 114B) disposed on the plurality of singulated substrates, and at least one stiffness ring (116A, 116B, 116C) disposed on the plurality of singulated substrates. A method for constructing an electronic assembly includes identifying a group of known good singulated substrates, joining the group of known good singulated substrates into a substrate panel, attaching at least one bridge to the substrate panel that electrically couples at least two of the known good singulated substrates, and mounting a plurality of electronic components onto the substrate panel, each electronic component of the plurality of electronic components corresponding to a respective known good singulated substrate.

A conductive trace interconnect tape for use with a printed circuit board or a flexible circuit substrate comprises a top insulating layer, an electrically conductive layer, and a bottom insulating layer. The top insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on top of the conductive trace interconnect tape. The electrically conductive layer is positioned underneath the top insulating layer. The electrically conductive layer is formed from electrically conductive material and includes electrical interconnect traces, electrical component pads, or electrically conductive planar portions. The bottom insulating layer is positioned underneath the electrically conductive layer. The bottom insulating layer is formed from electrically insulating material and is configured to provide electrical isolation from electrically conductive objects that are positioned on the printed circuit board or flexible circuit substrate.

Apparatus and associated methods relate to removing an adhesively-attached component from a circuit board assembly. A complementary pair of high-permeability members are positioned on opposite sides of the circuit board assembly about the adhesively-attached component. Then, a magnetic field is induced within the complementary pair of high permeability members via a coil driver generating an AC current in an inductive coil circumscribing a central pedestal of the complementary pair of high-permeability members. The magnetic field induced is directed through the adhesively-attached component via a central pedestal located proximate the adhesively-attached component. A return path for the magnetic field is provided about a periphery of the adhesively-attached component via a peripheral pedestal.

A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

A device for removing a defective electronic component from a circuit board includes a vacuum suction nozzle, a laser beam emitter and an infrared temperature sensor. The vacuum suction nozzle has a suction opening at which suction is generated. The suction opening is dimensioned to be larger than the defective electronic component. The laser beam emitter is oriented so as to emit a laser beam out the suction opening towards the electronic component on the circuit board. The temperature sensor measures the temperature of the electronic component based on infrared radiation emitted from around the electronic component. A method for removing the defective electronic component from the circuit board includes positioning the suction opening over the electronic component and directing the laser beam through the suction opening and onto the electronic component so as to heat and detach the electronic component, which is then sucked into the vacuum suction nozzle.

A defect inspection system includes a storage. The defect inspection system also includes a corrosion enhancing defect manager that obtains a circuit card including a trace that is to be encapsulated by a protective layer adapted to reduce corrosion of the trace; applies a voltage potential to the trace while the circuit card is disposed in a visual indicator bath; obtains an image of the trace while the voltage potential is applied; makes a determination, based on the image, that a visual indicator generated by the visual indicator bath is included in the image; and based on the determination: identifies a portion of the trace corresponding to the visual indicator; and applies encapsulant to the portion of the trace.

In some embodiments, connecting a component to a substrate by adhesion to an oxidized solder surface includes: forming one or more conductive solder connections between the component and one or more conductive portions of the substrate; adhering the component to an oxidized surface of a solder portion applied to the substrate.

This application relates to an apparatus and method for manufacturing a transparent electrode. One surface of a base substrate is surface-treated with a predetermined material or predetermined light. A conductive material and a hydrophilic solution are sprayed onto the surface-processed base substrate by using a spray block including a spray nozzle and a thermographic camera. The conductive solution is sprayed onto the processed base substrate to form a surface heating body. The surface heating body is heated to be photographed by the thermographic camera. A controller analyzes a photographed image to define an area of supplementation and form a supplemented surface heating body in the area of supplementation by using the spray nozzle, and thus a transparent electrode having uniform heating characteristics is manufactured.

A manufacturing method of a circuit board and a display device are provided. In the method, an error caused by that pin alignment on a conventional flexible substrate after a pin column is disposed on the flexible substrate based on a second pin position and a hot pressing process is performed is adjusted, so that the pin alignment is more accurate after the flexible substrate on which a pin is disposed based on a position of the to-be-disposed pin column is finally hot pressed with the display panel, thereby avoiding a problem that the pin is misplaced or short-circuited, and improving a good rate of the product.