Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.

A coil coating method for multilayer coating of a continuous metal strip, which is disposed in the strip passage, in which on a flat side of the metal strip, a curable polymer primer is applied by means of a roller application and cured in order to form an electrically insulating primer layer and a curable polymer varnish is applied onto said primer layer by means of roller application and cured in order to form an electrically insulating varnish layer, wherein at least one at least electrically conductive conductor track is printed on at least some areas between the primer layer and the varnish layer is proposed. In order to increase the reproducibility of the coil coating method, it is proposed that the conductor track be printed on some areas of the pre-cured primer layer and that the conductor track and varnish be applied using a wet-on-wet process.

Transparent conductive films comprising sparse metal conductive layers are processed after coating with an overcoat to lower the sheet resistance of the film. The sparse metal conductive layer can comprise a fused metal nanostructured network. A coating, such as a polymer overcoat or a polymer undercoat can noble metal ions that can further reduce the sheet resistance with the application of heat and optionally humidity. In particular, silver ions in a coating are demonstrated to provide important stabilization of sparse metal conductive layers, whether or not fused, upon the application of heat and humidity. A coating can further comprise a metal salt stabilization composition.

A flexible laminated sheet manufacturing method includes thermocompression-bonding an insulation film formed of a liquid crystal polymer onto a metal foil between endless belts to form a flexible laminated sheet. The thermocompression bonding includes heating the flexible laminated sheet so that the maximum temperature of the sheet is in the range from a temperature that is 45? C. lower than the melting point of the liquid crystal polymer to a temperature that is 5? C. lower than the melting point. The thermocompression bonding also includes slowly cooling the flexible laminated sheet so that an exit temperature, which is a temperature of the sheet when transferred out of the endless belts, is in the range from a temperature that is 235? C. lower than the melting point of the liquid crystal polymer to a temperature that is 100? C. lower than the melting point.

The present invention relates to a method for increasing adhesion strength between a surface of a copper, a copper alloy or a copper oxide and a surface of an organic material.

In a method for preparing a printed circuit board assembly (PCBA), the PCBA has a base circuit board having a plurality of electronic components installed thereon. First, the surface of the PCBA is cleaned with a cleaner. After cleaning, the staking material is applied around the plurality of electronic components around the circumference of the plurality of electronic components. After applying the staking material, the PCBA with the staking material is cured and inspected.

A system for applying a coating to a substrate. The system includes a coating station for applying a coating material to the substrate, where the coating station has a bottom portion, an oven for curing the coating material on the substrate, where the oven is positioned vertically below the bottom portion, and a first lift for transporting the substrate from the coating station to the oven. The system can also include an inspection station for inspecting the substrate. Each of the separate elements of the coating system, including the coating station, first lift, oven, and inspection station can define self-contained modules.

A gas detector includes an electrochemical gas sensor. The sensor includes a plurality of electrodes. At least one of the electrodes is formed of a catalyst/binder slurry which is halftone printed onto a substrate. The composite printed element and substrate are sintered to form the electrode.

An electrode connecting method includes: producing (i) a first circuit board including first electrodes spaced at a first distance and (ii) a second circuit board having a thermal expansion rate less than that of the first circuit board and including second electrodes spaced at a second distance, such that a difference in dimension between the first distance and the second distance falls within a particular permissible range; dehydrating the first circuit board so as to reduce the first distance; causing the first electrodes and the second electrodes to be respectively opposed to each other, with a thermosetting adhesive interposed between the first circuit board and the second circuit board; heating the thermosetting adhesive and at least the first circuit board of the first circuit board and the second circuit board; and bringing the first circuit board and the second circuit board into pressing contact with each other.

The present disclosure provides an electronic device and a manufacturing method thereof. The electronic device includes a substrate and a conductive structure disposed on the substrate, the conductive structure includes a conductive pattern made of a conductive paste and positive ions, the conductive pattern includes conductive particles and a resin, the positive ions are attached to the resin among the conductive particles. The technical solutions of the present disclosure are able to make the resistance of the conductive structure independent of drying and curing process without changing the existing conductive paste material system.