Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

Implementations described and claimed herein provide thin film devices and methods of manufacturing and implanting the same. In one implementation, a shaped insulator is formed having an inner surface, an outer surface, and a profile shaped according to a selected dielectric use. A layer of conductive traces is fabricated on the inner surface of the shaped insulator using biocompatible metallization. An insulating layer is applied over the layer of conductive traces. An electrode array and a connection array are fabricated on the outer surface of the shaped insulator and/or the insulating layer, and the electrode array and the connection array are in electrical communication with the layer of conductive traces to form a flexible circuit. The implantable thin film device is formed from the flexible circuit according to the selected dialectic use.

A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.

A method for producing a wiring circuit board includes a first step, a second step, and a third step. In the first step, while a work film which is a long metal substrate having a first surface and a second surface opposite to the first surface is fed and wound by a roll-to-roll method, a composition containing a photosensitive resin is applied onto the first surface to form an insulating film, and a protective film is interposed between the second surface and the insulating film of the work film in being wound. In the second step, while the work film having undergone the first step is fed and wound by the roll-to-roll method, the protective film is peeled from the insulating film, and the insulating film is subjected to light exposure treatment to be formed with a latent image pattern. In a third step, the insulating film having undergone the second step is subjected to development treatment to be patterned.

Systems and methods that enable printing of conformal materials and other waterproof coating materials at high resolution. An initial printing of a material on edges of a component is performed at high resolution in a first printing step, and a subsequent printing of the material on remaining surfaces of the component is applied in a second printing step, with or without curing of the material printed on the edges between the two printing steps. The printing of the material may be performed by a laser-assisted deposition or using another dispensing system to achieve a high resolution printing of the material and a high printing speed.

A manufacturing method of the present disclosure is a method for manufacturing a wiring body. The manufacturing method includes a growth process, a transfer process, and a peeling process. In the growth process, a conductive layer of a wiring body is grown on a catalyst provided on a pattern plate. In the transfer process, the conductive layer on the pattern plate is transferred to an insulator. In the peeling process, the conductive layer is peeled off from the pattern plate together with the insulator. When the wiring body is manufactured a plurality of times, the growth process, the transfer process, and the peeling process are repeatedly executed using the same pattern plate.

An electronic module includes a three-dimensional wiring board including a cavity portion in which a bottom surface and four wall surfaces are formed, a plurality of electrodes being provided on the bottom surface, and a plurality of electronic components mounted on the plurality of electrodes and including a plurality of chip components and an image pickup module configured to pick up an image in an opening section direction of the cavity portion. A wall surface among the four wall surfaces that corresponds to a direction in which the plurality of chip components are arrayed is an inclined surface having an inclination with respect to the bottom surface.

A process for conformally coating passive surface mount components soldered to a printed circuit substrate of a lidless flip-chip ball grid array package includes affixing a stiffener ring to the substrate before forming a conformal coating on the passive surface mount components. The stiffener ring is affixed to the substrate so that the plurality of passive surface mount components and the integrated circuit die are contained within an opening formed by the stiffener ring. After affixing the stiffener ring to the substrate, the conformal coating is formed on the passive surface mount components. The conformal coating extends over each of the passive surface mount components, around a periphery of each of the passive surface mount components, and under each of the passive surface mount components. A product made according to the process is also disclosed.

A motherboard with shockproof, shakeproof and waterproof functions is installed in a cabinet of an electronic device, the motherboard includes a PCB board, wherein front surface of the PCB board is provided with a plurality of structural members, a camera seat unit, an audio seat unit, a functional seat unit, a holder seat and a battery seat with shockproof and shakeproof functions; wherein each of the structural members is dispersedly fixed on a side of the PCB board, wherein the structural member screws and fixes the PCB board inside the cabinet, and wherein each of the seats and the PCB board are coated with waterproof coating.

A motherboard with shockproof, shakeproof and waterproof functions is installed in a cabinet of an electronic device, the motherboard includes a PCB board, wherein front surface of the PCB board is provided with a plurality of structural members, a camera seat unit, an audio seat unit, a functional seat unit, a holder seat and a battery seat with shockproof and shakeproof functions; wherein each of the structural members is dispersedly fixed on a side of the PCB board, wherein the structural member screws and fixes the PCB board inside the cabinet, and wherein each of the seats and the PCB board are coated with waterproof coating.