A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

One aspect of the present invention relates to a resin composition containing a polyrotaxane (A), an epoxy resin (B), and a curing agent (C), in which the curing agent (C) contains an acid anhydride (C-1) in an amount of 0.1 parts by mass or more and less than 10 parts by mass based on a total of 100 parts by mass of the polyrotaxane (A), the epoxy resin (B), and the curing agent (C).

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

A speed sensor assembly (114) includes a printed circuit board (PCB) (120) having a first main side and a second main side, a magnet (116) directly coupled to the first main side of the PCB (120), a sensor (118) electrically connected to the PCB (120), and a pole piece (125) directly coupled to the magnet (116) and to the sensor (118), wherein the magnet (116) includes a slot partially enclosed by the pole piece (125). The speed sensor assembly (114) including a slotted magnet (116) to reduce magnetic field amplitude for single sensing element hall effect sensor applications. The speed sensor assemblies (114) operate with both minimum and maximum air gaps.

The disclosed interference-fit frame includes (1) a border dimensioned for installation around an electrical component coupled to a circuit board, wherein (A) the border forms an opening in which the electrical component resides when the border is installed and (B) at least a portion of the border constitutes a retention dam that rises beyond the electrical component when the border is installed, and (2) at least one protuberance that extends from the border into the opening. Various other apparatuses, systems, and methods are also disclosed.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

An electronic component includes an element body, an external electrode, and a metal terminal. In the metal terminal, a base includes a first surface and a second surface opposing each other, and a pair of third surfaces coupling the first surface and the second surface. A first metal layer is disposed on the first surface and connected to solder with which the external electrode and the metal terminal are connected together. A second metal layer is disposed on the second surface. A coating layer is disposed on each of the third surfaces. The first metal layer and the second metal layer each include an outermost layer containing Sn. Each of the coating layer includes an outermost layer lower in solder wettability than the respective outermost layers of the first metal layer and the second metal layer.

A method is provided for mounting a semiconductor IC to a substrate without a socket or solder. The method includes disposing a guide structure on the substrate. The substrate has multiple contact pads disposed thereon. The substrate also has multiple nuts formed therein for connecting to one or more bolts. The method also includes placing the semiconductor IC inside the guide structure such that the semiconductor IC makes contact with the contact pads. A top plate is disposed on the semiconductor IC. Further, the top plate and the semiconductor IC are fastened to the substrate.

An electrical terminal includes a terminal body and a mounting portion. The terminal body has a front edge, a rear edge, and two opposite lateral edges. At least part of the terminal body is bent, and the two lateral edges are butt jointed to form a buttjoint portion. The buttjoint portion has a joint seam between the two lateral edges which are butt jointed, and the buttjoint portion further includes a stamped groove spanning the joint seam. The mounting portion extends from the terminal body. An electrical connector is also provided, which includes a base and the electrical terminal.