An independent loading mechanism for use with a CPU connector includes a metallic frame cooperating with a back plate module to sandwich a printed circuit board therebetween. A plurality of screw nut units are provided around the four corners of the frame. A plurality of hollow spacers are secured to the corresponding through holes of the frame so as to allow the corresponding screw nut units moveable relative to the frame along the vertical direction within a range larger than a thickness of the frame, thus avoiding improper interference between the screw nut units and the corresponding screw posts of the back plate module during sequential screwing.

An electrical connector and method of assembling an electrical connector that is configured for mounting to a printed circuit board. The electrical connector has interleaved contact wafers to form one or more contact wafer assemblies that are supported by an insert of the electrical connector, such that the one or more contact wafer assemblies form a predetermined arrangement of mating ends of the plurality of contacts at a mating interface of the electrical connector.

An electronic device is provided. The electronic device includes a housing that includes a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a side surface surrounding at least a portion of a space between the first surface and the second surface, a first printed circuit board seated inside the housing, a second printed circuit board seated inside the housing, a plurality of cables configured to electrically connect the first printed circuit board and the second printed circuit board, and at least one cable fixing apparatus coupled to the first printed circuit board or the second printed circuit board to accommodate and fix the plurality of cables. In addition, various embodiments identified through the specification are possible.

A high frequency connector includes a case, a circuit board, a component protecting member and a cable. The circuit board is configured in the case and includes an electronic component and a plurality of solder pads. The component protecting member includes a case body and is configured on the circuit board. One side of the case body has an opening, and a containing space is formed between the opening and the inner face of the case body. A crossing structure is formed by the outer surface of the other side of the case body. When the component protecting member is configured on the circuit board, the component protecting member covers the electronic component in the containing space to maintain the transmission characteristics of the electronic component.

Various technologies for integrating a microinverter with a photovoltaic module are disclosed. An alternating current photovoltaic (ACPV) module includes a photovoltaic module having a frame and a junction box including a direct current (DC) output connector, and a microinverter having a housing coupled to the frame and a DC input connector electrically mated with the DC output connector of the photovoltaic module.

A composite electronic component includes a composite body in which a multilayer ceramic capacitor and a ceramic chip are coupled to each other, the multilayer ceramic capacitor including a first ceramic body in which a plurality of dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween are stacked, and first and second external electrodes disposed on both end portions of the first ceramic body, and the ceramic chip being disposed on a lower portion of the multilayer ceramic capacitor and formed of a ceramic material having substantially no piezoelectric property, wherein a ratio (T/L) of thickness (T) of the ceramic chip to length (L) of the multilayer ceramic capacitor is selected to minimize vibration of the ceramic chip.

A method for manufacturing a coil component comprises: forming a coil conductor including a winding portion, the winding portion including a plurality of first conductor portions and one or more second conductor portions smaller in number than the first conductor portions, the first and second conductor portions alternate with and connected to each other; forming a molded body by molding composite magnetic material including metal magnetic particles and a binder with the coil conductor being disposed inside the composite magnetic material; and heating the molded body to produce a magnetic base body. The magnetic base body is formed such that a distance between the first conductor portions and a first surface of the magnetic body is greater than a distance between the second conductor portions and a second surface of the magnetic base body opposite to the first surface, by molding, cutting or polishing.

A method for manufacturing a multilayer circuit board includes providing an inner circuit substrate defining a through hole, attaching a support plate to the inner circuit substrate to seal an opening of the through hole; placing an electronic module in the through hole; pressing a first substrate onto a surface of the inner circuit substrate; removing the support plate; pressing a second substrate onto another surface of the inner circuit substrate, the first substrate and the second substrate infilling the through hole and jointly encapsulating the electronic module; forming a first conductive wiring layer on a surface of the first substrate facing away from the first surface to obtain a first circuit substrate, and forming a second conductive wiring layer on a surface of the second substrate facing away from the second surface to obtain a second circuit substrate. A multilayer circuit board is also disclosed.

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

A transaction device includes a metal layer with one or more discontinuities in the metal layer. Each discontinuity comprises a gap in the metal layer extending from the front surface to the back surface, including at least one discontinuity that defines a path from the device periphery to the opening. A transponder chip module is disposed in the opening. A booster antenna is in communication with the transponder chip module. The device may include at least one fiber-reinforced epoxy laminate material layer. The transponder chip module and the booster antenna may comprise components in a payment circuit, with the metal layer electrically isolated from the payment circuit. The booster antenna may be formed on or embedded in the fiber-reinforced epoxy laminate material layer. Processes for manufacturing transaction devices including a metal layer with one or more fiber-reinforced epoxy laminate material layers are also disclosed.