An integrated circuit structure and method of forming is provided. A die is placed on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board.

A connection terminal unit that can be appropriately connected to terminal connection portions of a semiconductor module including a semiconductor element and that can reduce a projection area when seen in a direction orthogonal to a direction along a chip surface is realized. Connection terminal unit includes plurality of connection terminals facing and connected to plurality of terminal connection portions of semiconductor module, and terminal mold portion holding connection terminals. Terminal mold portion has abutment portion that abuts against semiconductor module or base material holding semiconductor module. Abutment portion has vertical abutment portion that abuts against semiconductor module or base material from vertical direction that is a direction in which connection terminals face terminal connection portions, and side abutment portion that abuts against semiconductor module or base material from at least two directions that are different from each other and intersect with vertical direction.

A power control module includes a power device having a first side and a second side opposite from the first. The power control module includes a printed wiring board (PWB) spaced apart from the first side of the power device. The PWB is electrically connected to the power device. A heat sink plate is soldered to a second side of the transistor for heat dissipation from the transistor. The PWB and/or the heat sink plate includes an access hole defined therein to allow for access to the transistor during assembly. A method of assembling a power control module includes soldering at least one lead of a power device to a printed wiring board (PWB), pushing the power device toward a heat sink plate, and soldering the power device to the heat sink plate.

A supporter for electronic parts includes: an adsorption plate which is attached to an upper surface of a first electronic part among the first electronic part and a second electronic part where the first electronic part and a second electronic part are spaced apart from each other on a plane; and a supporting member which includes 1) a first support part which supports a lower surface of the second electronic part and 2) a connection part which connects the adsorption plate and the first support part. On the plane, about 70-90% of the area of the first support part is overlapped with the second electronic part.

An electronic device includes a casing, a circuit board and a grounding assembly. The circuit board has a first surface and a second surface, wherein an input terminal and an output terminal are disposed on the second surface. The grounding assembly comprises a conducting terminal, a first grounding element and a second grounding element. The conducting terminal is disposed on the first surface of the circuit board, and the first grounding element is disposed adjacent to the conducting terminal. The first grounding element penetrates the circuit board and electrically couples with the conducting terminal and the casing, and the second grounding element correspondingly penetrates the circuit board and the conducting element, so that a first portion of the second grounding element electrically couples with the input terminal and the output terminal of the circuit board, and a second portion of the second grounding element electrically couples with the conducting terminal.

A system and method of mounting and electrically contacting a first printed circuit board perpendicularly onto a second printed circuit board within a housing includes inserting the first printed circuit board into an upper part of the housing using a stop surface arranged on an inner side surface of the upper part of the housing and arranged to support the electrical contacting and assembly, locking the first printed circuit board in the upper part of the housing using a locking system, and mounting the upper part of the housing with the locked printed circuit board on a lower part of the housing in which the second printed circuit board is mounted.

An integrated circuit structure and method of forming is provided. A die is placed on a substrate and encased in molding compound. A redistribution layer is formed overlying the die and the substrate is removed. One or more surface mounted devices and/or packages are connected to the redistribution layer on an opposite side of the redistribution layer from the die. The redistribution layer is connected to a printed circuit board.

An electronic component and a mounting substrate thereof provide metal frames that reduce stress transmission while occupying only a limited mounting area. The electronic component includes a body, and first and second external electrodes respectively disposed on opposite ends of the body. A first metal frame includes a first support portion bonded to the first external electrode and a first mounting portion extending from a lower end of the first support portion toward the second external electrode. A second metal frame includes a second support portion bonded to the second external electrode and a second mounting portion extending form a lower end of the second support portion away from the first external electrode.

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated therein, and external electrodes each at one of two end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface of the capacitor main body, and opposed and spaced apart from each other. The two interposers include a nickel-plated layer and a tin-plated layer on an outer periphery thereof. The two interposers each include a non-plated region without the nickel-plated layer on an end surface at which the two interposers face each other.

A multilayer ceramic capacitor includes a capacitor main body including a multilayer body including dielectric layers and internal electrode layers alternately laminated, and external electrodes each at end surfaces of the multilayer body and connected to the internal electrode layers, and two interposers on a surface in a lamination direction of the capacitor main body, and spaced apart from each other in a length direction connecting the two end surfaces and intersecting the lamination direction. The external electrodes each include a bulge portion protruding in the lamination direction on the surface of the capacitor main body. The interposers each include a recess portion on each of the end surfaces, and in a cross section extending in the lamination direction and the length direction and passing through a center in a width direction. The bulge portion is closer to the end surface in the length direction than the recess portion.