This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven. The method comprises a step of separating and constructing a housing of the electroacoustic component. The housing comprises a shell seat and a base seat, the shell seat is provided with a plurality of sound producing components, and the base seat is provided with at least two conducting terminals for adhering the base seat to the PCB. The conducting terminals on the base seat and the at least two contacts on the PCB are adhered to each other and electrically connected in the reflow oven, and then the shell seat and the base seat are combined to make the shell seat and the base seat with the PCB combined outside the reflow oven into a single body to form an electroacoustic component that is mounted on the PCB.

A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.

A component holding device for the fixed-position arrangement of an electric component on a circuit board, having a support side for receiving the electric component, wherein at least one pretensioning element and at least one first latching element for the fixed-position latching of the electric component are provided on the support side, and the at least one pretensioning element is designed to exert a pretensioning force on the electric component, which presses the electric component against the at least one first latching element, and having at least one second latching element on an underside lying opposite the support side, wherein the second latching element is designed to fix the component holding device in a predefined location in a fixed position on the circuit board.

An onboard power supply device includes capacitors, a holder holding the capacitors, a mounting board having the capacitors mounted thereon and having the holder fixed thereto, and a heat-generating component mounted on the mounting board. Each of the capacitors includes a capacitor body and a lead terminal extending from the capacitor body. The holder includes a base part, first holding parts bundled by the base part and holding the capacitors, second holding parts each connected to a corresponding one of the first holding parts, and a fixing part extending from an outer edge of the base part toward the mounting board and fixed to the mounting board. The capacitor body of each of the capacitors is held by a corresponding one of the first holding parts. The lead terminal of each of the capacitors is held by a corresponding one of the second holding parts. The mounting board has a through-hole therein through which the lead terminal passes. The through-hole is connected to the lead terminal. The corresponding one of the second holding parts has a holding through-hole therein extending along a through-axis coinciding with the through-hole. An inner wall of the holding through-hole contacts the lead terminal. This onboard power supply device has a small size.

A method of manufacturing an item inventory apparatus including an item storage area and a plurality of sensors located within the item storage area may include the steps of: selecting one or more preconfigured boards, each of the one or more preconfigured boards having a plurality of predefined sensor placement locations, providing at least one storage material having a plurality of storage locations for a plurality of items, locating the plurality of sensors at least at some of the plurality of predefined sensor placement locations, and fitting the one or more preconfigured boards with the located plurality of sensors and the storage material to the item storage area. A related system and apparatus are also disclosed.

A cable card assembly includes a circuit card having a substrate including mating pads at a mating end and cable pads at a cable end. The circuit card has a ground plane. Cables are terminated to the circuit card at the cable end each having signal conductors, an insulator surrounding the signal conductors, and a ground conductor surrounding the insulator. Cable shields are terminated to the ground plane providing electrical shielding for the corresponding cables. Each cable shield includes an end wall between first and second side walls to form a cable cavity. The end wall has a connecting portion between the first and second side walls and a shroud portion extending from the connecting portion covering a portion of the ground conductor. The shroud portion is curved to follow a curvature of the ground conductor and extend along opposite sides of the ground conductor.

The present invention is directed to a wire comb. The wire comb includes a flat body which includes a first end and a second end. The ends are connected by an arcuate section which has an upper and lower surface. The upper surface of the arcuate section has a wire mount area that includes at least one opening formed in the upper surface with each opening including a shape selected to receive and hold a wire within. A mounting feature extends from at least one of the first end and the second end. The mounting feature is adapted to engage a printed circuit board.

A support structure supports a component mounted on a mounting surface of a structure by pressing the component to the mounting surface side and includes a first support tool and a second support tool used so that the component is pressed to the mounting surface side and supported and a fixing portion provided on the structure and fixing the first support tool and the second support tool. The first support tool and the second support tool are fixed to the same fixing portion.

An electronic component has capacitor chips where terminal electrodes are formed on both end surfaces, individual metal terminals connected to the terminal electrodes, an insulation case accommodating the capacitor chips, and a connecting portion interconnecting a plurality of the insulation cases.

A mounting structure for a heater element includes a heater element having a surface to be cooled, a board on which the heater element is mounted, a cooling member that cools the surface to be cooled of the heater element mounted on the board, and a supporting member temporarily fixed to the board, the supporting member temporarily fixing the heater element.