A surge protective device (SPD) circuit system for providing overvoltage protection to an electrical power circuit includes a PCB assembly, an SPD module, and an SPD monitoring system. The PCB assembly selectively mountable on the PCB includes a PCB and a remote signal (RS) PCB contact on the PCB. The SPD module includes an overvoltage clamping element and an RS spring contact including an RS contact portion. When the SPD module is mounted on the PCB and the electrical power circuit is connected to the PCB: the PCB electrically connects the SPD module to the circuit and the overvoltage clamping element provides overvoltage protection to the circuit; the RS contact portion engages the RS PCB contact; the RS spring contact is elastically deflected and persistently loads the RS contact portion against the RS PCB contact; and the RS spring contact is electrically connected to the SPD monitoring system via the RS PCB contact.

A pressurizing device includes a pressurizing plate having a first pressurizing plate surface and a second pressurizing plate surface opposite to each other. The first pressurizing plate surface presses an electronic element located on a first circuit board surface of a circuit board. The pressurizing device includes a plurality of peripheral pressurizing units applying pressure to a peripheral region of the second pressurizing plate surface and a plurality of central pressurizing units applying pressure to a central region of the second pressurizing plate surface.

A controller for an e-machine of a turbomachine including a support structure, a printed circuit board, and a fastener arrangement that retains the printed circuit board on the support structure, the fastener arrangement including a resilient member that resiliently biases the printed circuit board towards the support structure.

An electronic device includes: a housing and a printed circuit board (PCB) structure disposed in the housing. The PCB structure includes a circuit board including an opening area formed through a first surface of the circuit board and a second surface of the circuit board opposite the first surface and a conductive pattern formed in a peripheral area around the opening area, a plate disposed on the second surface of the circuit board covering the opening area, an electronic element disposed on the plate and electrically connected with the circuit board, a resin portion disposed between the plate and the circuit board and extending from the conductive pattern, the resin portion including a conductive material, and a solder portion formed between the resin portion and the plate.

A combination standoff and LED includes a surface mount solder standoff which can be either threaded or unthreaded, and a surface mount LED disposed and fixed in the center of the base of the standoff. The combination standoff and LED is adapted to receive a lightpipe via the either threaded or unthreaded portion of the surface mount solder standoff. This combination standoff and LED results in a single piece of hardware which simplifies the physical PCBA layout design and removes any Computer Aided Design (CAD) placement errors that would normally be present if two separate hardware components were placed together manually.

A package structure includes a first dielectric layer, semiconductor device(s) attached to the first dielectric layer, and an embedding material applied to the first dielectric layer so as to embed the semiconductor device therein, the embedding material comprising one or more additional dielectric layers. Vias are formed through the first dielectric layer to the at least one semiconductor device, with metal interconnects formed in the vias to form electrical interconnections to the semiconductor device. Input/output (I/O) connections are located on one end of the package structure on one or more outward facing surfaces thereof to provide a second level connection to an external circuit. The package structure interfits with a connector on the external circuit to mount the package perpendicular to the external circuit, with the I/O connections being electrically connected to the connector to form the second level connection to the external circuit.

The present disclosure concerns a mounting device for semiconductor packages, and a heat dissipation assembly with such a mounting device. The mounting device includes a bottom side comprising one or more cavities to house semiconductor packages, and a top side comprising a plurality of holes extending from the bottom side to the top side for accommodating contact pins of the semiconductor packages. A fixation mechanism fixes the mounting device to a heat dissipation structure.

A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.

A locator is for aligning cables which are configured to be connected with a circuit board having an accommodated portion. The locator comprises at least a main portion which extends in a pitch direction. The main portion is, at least in part, formed with at least one circuit board accommodating portion. The main portion is formed with at least one first through hole and at least one second through hole which is different from the first through hole. The at least one circuit board accommodating portion is configured to accommodate the accommodated portion of the circuit board. The at least one circuit board accommodating portion opens at least forward in a front-rear direction perpendicular to the pitch direction. In the pitch direction, the at least one first through hole is provided at a location which is different from a location of the circuit board accommodating portion.

Disclosed are special component carriers made of MID-capable plastic in order to make the geometric arrangement of electrical components, such as microprocessors, LEDs, sensors, antennas and the like, on a circuit board more flexible. Said component carriers can have a standardized footprint for connecting to the circuit board and can be adapted to the terminals and the geometric arrangement of the components using individually applied conducting tracks, in particular in an LDS process. Furthermore, the specially shaped component carriers allow the electrical components to be geometrically oriented, in particular at a right angle to the circuit board and parallel to the circuit board, which is especially highly advantageous for antennas and acceleration sensors. Furthermore, SMT soldering is made possible in the pre-mounted state even for temperature-sensitive components.