A method of forming an electronic device is described which comprises a stack of electronic components wherein each electronic component comprises a face and external terminations. A component stability structure is attached to at least one face. A circuit board is provided wherein the circuit board comprises circuit traces arranged for electrical engagement with the external terminations. The component stability structure mechanically engages with the circuit board and inhibits the electronic device from moving relative to the circuit board.

An electronic device package includes a molded case, a plurality of leads and a case lid. The molded case includes integrally formed side walls, end walls, and a bottom wall, which together define an interior for components. Each side wall includes top and bottom portions. The top portion includes first and second surfaces extending downward from a top edge of the side wall. The bottom portion has a top surface that extends away from the interior, a third surface extending downward from the top surface to a bottom edge, and a fourth surface extending downward from the second surface to the bottom wall. The leads are molded in the side wall from the bottom edge to the top edge. Each lead has an end extending above the top edge, and another end extending along the bottom edge of the side wall. The case lid is engaged with the molded case.

Through the use of a method of producing electronic components, a plurality of electronic components are obtained by cutting, along a predetermined cutting line, a laminate including a first circuit board and a second circuit board both mounted with circuit components. The method of producing electronic components includes: a stacking step of stacking the second circuit board on the first circuit board with a spacer interposed therewith, the first circuit board being provided with a filled via around a mounting region of the circuit components; a filling step of filling a filling space formed between the first circuit board and the second circuit board using the spacer with insulating resins; and a cutting step of cutting the laminate along the cutting line, the cutting line dividing the filled via, and exposing the filled via from a cut surface to acquire terminal portions of the electronic components.

An electronic component includes a first functional element including a pair of first connecting electrode portions formed on a first mounting surface, a pair of pillar electrodes connected to the corresponding first connecting electrode portions, a second functional element that includes a pair of second connecting electrode portions formed on a second mounting surface and that is arranged in a space defined by the first mounting surface of the first functional element and the pair of pillar electrodes, a pair of pad electrodes connected to the corresponding second connecting electrode portions, and a sealing resin that seals the pair of pillar electrodes, the pair of pad electrodes and the second functional element so as to expose the first lower surfaces of the pair of pillar electrodes and the second lower surfaces of the pair of pad electrodes.

A package comprises a body, and an electrically conductive pattern supported by said body. An interface portion is configured to receive a module to a removable attachment with the package. The electrically conductive pattern comprises, at least partly within said interface portion, a wireless coupling pattern that constitutes one half of a wireless coupling arrangement.

A transaction card having an opening in a metal card body, a booster antenna in the opening, and a molding material about the booster antenna. A process for manufacturing the transaction card includes forming an opening in a card body, inserting a booster antenna into the opening, and molding a molding material about the booster antenna.

A method for forming a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example includes filling a first cavity having a tapered surface with a body material. A first layer of a constraining material is provided on top of the first cavity and has a second cavity having a width that is smaller than the first cavity. The second cavity is filled with the body material. Successive layers of the constraining material are provided on top of the first layer of the constraining material. Cavities of the successive layers of the constraining material are selectively filled with at least the body material to form layers of the main body portion of the Z-directed component. The constraining material is dissipated to release the Z-directed component from the constraining material and the Z-directed component is fired.

An apparatus including a carrier substrate configured to move a microelectronic device. The apparatus further includes a rotatable body configured to receive the microelectronic device. Additionally, the apparatus includes a second substrate configured to receive the microelectronic device from the rotatable body.

A retention structure which provides both soldering and vibration stabilization of a capacitor as the capacitor is mounted to a printed circuit board (PCB) of an electronic module. An aperture is part of the PCB to stabilize and prevent the capacitor from rolling during manufacturing. Once secured to the PCB, Room Temperature Vulcanization (RTV), or similar adhesive bead, is placed onto a rigidizer or base plate (typically a casted or aluminum sheet plate). Once the capacitor is soldered in place and fixated on the PCB, the assembly is then placed onto the rigidizer such that the PCB is attached to the rigidizer using an adhesive, and the RTV bead contacts and is deformed by the capacitor, connecting the capacitor to the rigidizer to provide vibration stabilization support. The electronic module includes a cover, and optional dampening/constraint pads are attached to the cover of the electrolytic capacitor for additional vibration stabilization.

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.