A backplane connector assembly includes a first backplane connector and a second backplane connector. The first backplane connector includes a number of first conductive terminals, a first insulating frame, a first metal shield and a second metal shield. The first metal shield includes a first elastic piece, and the second metal shield includes a second elastic piece. The second backplane connector includes a number of second differential signal terminals, an insulating block sleeved on the second differential signal terminals, and a metal shell sleeved on the insulating block. When the first backplane connector is mated with the second backplane connector, the first elastic piece and the second elastic piece are in contact with the metal shell to increase the grounding shielding area, reduce crosstalk and improve the quality of signal transmission.

A backplane connector includes a wafer. The wafer includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield located on opposite sides of the insulating frame. The insulating frame includes a number of first posts and a number of second posts. The first metal shield has a number of first mounting holes to receive the first posts. The second metal shield has a number of second mounting holes to receive the second posts. With this arrangement, the first metal shield and the second metal shield can be easily positioned with the insulating frame.

A backplane connector includes a number of conductive terminals, an insulating frame, a first metal shield and a second metal shield. Each conductive terminal includes a connection portion. The conductive terminals include differential signal terminals, a first ground terminal and a second ground terminal. The first metal shield and the second metal shield are respectively in contact with two opposite side surfaces of the first ground terminal and the second ground terminal. As a result, a shielding cavity surrounding the connection portions of the differential signal terminals is formed. This arrangement can provide better shielding for the differential signal terminals over the length of the connection portion, reduce crosstalk, and improve the quality of signal transmission.

A circuit component arrangement includes a base and a plurality of circuit components mounted to the base. A bonding agent adheres the circuit components in intimate contact to the base. The bonding agent is disposed in a respective open channel defined in an outward facing surface of the base in contact with each of the circuit components. A method of assembling a circuit component arrangement includes temporarily fastening a plurality of circuit components to a base. A bonding agent is injected into a respective open channel defined in the base to adhere each of the plurality of circuit components to the base. The plurality of circuit components are unfastened from the base. Injecting a bonding agent can include ceasing injection of bonding agent upon appearance of bonding agent in a window opening in fluid communication with the open channel.

A printed circuit board module (10) has a printed circuit board (20) with a first side (21), a second side (22) and a contact hole (30). A sleeve-type via (32) is provided in the contact hole 30. An annular ring (35, 36) is associated with the via (32), on at least one side (33, 34). The annular ring (35, 36) is arranged on the first side (21) or on the second side (22) of the printed circuit board (20). The annular ring (35, 36) is electrically connected to the via (32). The annular ring (35, 36) has an annular ring edge (40), at least in sections. The printed circuit board module (10) has a solder resist layer (50). It extends, at least in sections, from outside the annular ring edge (40) over the annular ring edge (40) to an outer region (42) of the annular ring (35, 36). An inner region (44) not covered with the solder resist layer (50), remains on the annular ring (35, 36).

A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes simultaneously extruding a plurality of materials according to the structure of the Z-directed component to form an extruded object and forming the Z-directed component from the extruded object. In one embodiment, the extruded object is divided into individual Z-directed components. In one embodiment, the timing of extrusion between predetermined sections of one of the materials is varied in order to stagger the sections in the extruded object.

An electromagnetic interference (EMI) shielding and thermal management system, method, and automotive radar system for an integrated circuit of a product circuit board (PCB) of a radar sensor includes a shield member disposed above the integrated circuit and extending to unpopulated areas of the PCB and configured to shield the integrated circuit from EMI and transfer heat energy generated by the integrated circuit away from the integrated circuit, and a set of pin members configured to be inserted through respective apertures defined by the shield member and the PCB and configured to transfer the heat energy from the shield member to an environment external to the PCB.

A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

A press-fit insertion method is provided. The press-fit insertion method includes loading press-fit pins into a connector, heating a printed circuit board (PCB) defining plated through holes (PTHs) into which the press-fit pins are insertable and pressing the connector onto the PCB to insert the press-fit pins into the PTHs with the PCB remaining heated.

A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.