A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or failed; and transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or failed; and transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.

Provided is a semiconductor module including: a layered substrate on which a semiconductor chip is provided; and a connection terminal including a connection portion connected to the layered substrate, wherein the connection portion includes at least one ultrasonic connection section, and at least one laser-welded section, at least a portion of which is provided at a location other than a location at which the ultrasonic connection section is provided. The at least one ultrasonic connection section may be provided to be closer to the leading end of the connection portion than the at least one laser-welded section is.

An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.

A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.

A secondary battery pack comprises a battery and a protection circuit module (PCM), a pair of electrodes of the battery being connected to a protection circuit board (PCB) forming part of the PCM such that the electrode connections are located on a face of the PCB other than a major face that receives PCM components thereon. In some embodiments, the PCM components are mounted on one of a pair of major faces of the PCB, the electrode connections being located on the opposite one of the major faces. In other embodiments, the electrode connections are located on a peripheral edge face that extends transversely between the pair of major outer faces of the PCB. The spatial arrangement of the electrode connections and the PCM components on the PCB is such that substantially the entirety of one major outer face of the PCB is available for the placement of PCM components.

A secondary battery pack comprises a battery and a protection circuit module (PCM), a pair of electrodes of the battery being connected to a protection circuit board (PCB) forming part of the PCM such that the electrode connections are located on a face of the PCB other than a major face that receives PCM components thereon. In some embodiments, the PCM components are mounted on one of a pair of major faces of the PCB, the electrode connections being located on the opposite one of the major faces. In other embodiments, the electrode connections are located on a peripheral edge face that extends transversely between the pair of major outer faces of the PCB. The spatial arrangement of the electrode connections and the PCM components on the PCB is such that substantially the entirety of one major outer face of the PCB is available for the placement of PCM components.

A battery cell includes a first power tab and a first conducting wire. The first power tab may include a proximal end connected to the battery cell, and may provide a first output terminal for the battery cell. The first conducting wire may be connected to a distal end of the first power tab, and may be encircled by the first power tab. The first conducting wire may connect with a power circuit board to provide power from the battery cell.

An electronic component mounting substrate includes an electronic component and a substrate that are electrically connected at a plurality of places on a bottom surface of the electronic component. At least two places of the plurality of places are electrically connected by bonding using a conductive adhesive, and places other than the at least two places of the plurality of places are electrically connected by soldering using a paste solder.

A printed circuit board (PCB) (4) including an upper surface having one or more electrical terminals (9) thereon, said terminal adapted for connection to corresponding terminal of one or more electrical components, and further including one or more platforms (10) fabricated thereon, said platforms being located adjacent to corresponding component terminals, said platforms being adapted to support an electrical component thereupon, such that a portion of the component overhangs said platform above said corresponding PCB terminal.