Disclosed are film packages and methods of fabricating package modules. The film package includes a film substrate that includes a chip region and a peripheral region facing each other in a first direction, a plurality of output pads that are arranged in the first direction on the chip region and on the peripheral region, and a semiconductor chip on the chip region and electrically connected to the output pads. The output pads on the chip region are arranged at regular first intervals along the first direction. The output pads include a plurality of first output pads that are arranged at a first pitch along the first direction on the chip region and a plurality of second output pads on the peripheral region. The second output pads are arranged at a second pitch greater than the first pitch of the first output pads.

A display device and an electronic apparatus. The display device includes a display panel, a first circuit board and a second circuit board. The display panel includes a light-outgoing side and a non-light-outgoing side opposite to the light-outgoing side; the first circuit board is electrically connected to the display panel and positioned at the non-light-outgoing side; and the second circuit board is configured to be electrically connected to the first circuit board, and the second circuit board includes a functional circuit in signal connection with the display panel.

A device includes an elastic base, a device body provided on the base, a wiring line provided on the base, a coupling member coupled to the wiring line, and an electrically conductive adhesive layer provided between the wiring line and the coupling member. The wiring line extends from the electrically conductive adhesive layer to the device body. The wiring line has a wiring portion overlapping with the electrically conductive adhesive layer. The degree of polymerization of the electrically conductive adhesive layer decreases in the extending direction of the wiring portion.

The disclosure provides a power supply module, including: a pin; a magnetic core including: a first and second magnetic plate arranged in parallel; a first upper wiring layer; a first middle wiring layer; a first lower wiring layer, wherein at least a part of the first upper wiring layer and the first middle wiring layer are connected to form a first winding surrounding the first magnetic plate, at least a part of the first lower wiring layer and the first middle wiring layer are connected to form a second winding surrounding the second magnetic plate. The magnetic core, the first and second winding form a magnetic element electrically connected to a switch. A magnetic loop surrounds a first axis, the first winding surrounds a second axis, the second winding surrounds a third axis, the first, second and third axis are parallel to a plane where the pin is located.

A bending apparatus including a stage on which a bending object is positioned, a bending bar, a drive unit connected to the bending bar and configured to move the bending bar according to a standard route to bend the bending object by coming into contact with the bending object, and a measuring unit that measures a movement route of the bending bar.

A display module and a display device are disclosed. The display module includes a first flexible circuit board, a display substrate, and a touch sensor disposed on the display side of the display substrate. The display substrate includes a flat region and curved surface regions; the touch sensor includes first and second bonding regions; the first bonding region and the second bonding region are on a surface, away from the display substrate, of the touch sensor, stacked with the flat region and spaced apart from each other; the first flexible circuit board is electrically connected with the touch sensor through the first bonding region and the second bonding region; the first flexible circuit board includes a main body and first and second bonding connection portions; the first and second bonding connection portions are respectively bonded with the first and second bonding regions.

An electronic device includes a display panel having first pads, a circuit board that includes second pads corresponding to the first pads, and a conductive adhesive member disposed between the display panel and the circuit board to connect the first pads and the second pads, in which the conductive adhesive member includes a first resin layer adjacent to the display panel, a second resin layer disposed between the first resin layer and the circuit board and having a curing agent different from that of the first resin layer, and conductive particles disposed in the first resin layer wherein at least one of the second pads protrudes through the second resin layer and is in contact with the conductive particles.

A display device and a chip-on-film structure thereof are provided. The chip-on-film structure includes a substrate, multiple first output pads, multiple second output pads, multiple first lead wires, and multiple second lead wires. The substrate has a surface including a bonding zone. The first and output pads are located in the bonding zone. The first lead wires and the first output pads are located on the same surface of the substrate. The first lead wires and the second lead wires are located on two opposite surfaces of the substrate. Each of the first lead wires is connected to one of the first output pads. Each of the second lead wires is connected to one of the second output pads. The second lead wires each have a portion corresponding to the bonding zone and having the terminal sections that are respectively opposite to the first and second output pads.

A flexible circuit film bonding apparatus includes: a stage configured to support a TFT substrate; a pressing head configured to press and heat a flexible circuit film attached on the TFT substrate with an anisotropic conductive film interposed therebetween; a backup plate configured to support and heat the TFT substrate positioned below the flexible circuit film; and a heating control unit configured to control a temperature of a lower surface of the pressing head and an upper surface of the backup plate, wherein the temperature of the upper surface of the backup plate is less than 170 degrees Celsius.

Disclosed is a printed circuit board (PCB) module including a first PCB comprising a base PCB, a sidewall disposed on a periphery of the base PCB, and conductive vias penetrating the sidewall, a second PCB disposed on the sidewall to cover a cavity formed by the sidewall of the first PCB, and at least one electronic component disposed inside the cavity and located on the first PCB and/or the second PCB, wherein the sidewall comprises a first layer disposed on an upper face of the base PCB and constructed of an insulating member, a second layer disposed on the first layer and comprising a polyimide, a third layer disposed on the second layer and constructed of an insulating member, and a fourth layer disposed on the third layer and comprising a conductive member conductive with respect to the conductive vias.