An electrical device, e.g., an inverter or converter, includes a first and a second printed circuit board. The first printed circuit board includes protruding tab regions, and a respective tab region protrudes into a respective recess of the second printed circuit board. Contact pins, e.g., of one or more plug connector parts, protrude into holes of the second printed circuit board.

A circuit board assembly includes a first circuit board, a second circuit board having a first side extending adjacent to a first side of the first circuit board, and a metal fitting including a portion bent at the angle and spanning both the first side of the first circuit board and the first side of the second circuit board. The second circuit board is in a posture having an angle other than 180° to the first circuit board. The metal fitting is fixed to both the first circuit board and the second circuit board.

A module, comprising: a printed circuit board (PCB); a power and management connector disposed on the PCB to connect to a computing device via a first cable; a data connector disposed on the PCB to connect to the computing device via a second cable; and a memory slot, to accept a memory device, disposed on the PCB and connected to the power and management connector and the data connector.

A circuit interrupter including a line conductor, a neutral conductor, a printed-circuit board coil, and a test circuit. The printed-circuit board coil has an aperture configured to receive the line conductor. The test circuit is electrically connected to the printed-circuit board coil. The test circuit is configured to determine an arc fault condition based on a signal of the printed-circuit board coil.

Discussed is a PCB assembly and a manufacturing method of a PCB assembly in which at least two PCBs are electrically connected. The PCB assembly includes a connection metal pin having a body and legs, the body having electric conductivity, and having a pin shape elongated in one direction, a portion of the body being bent according to a predetermined angle of the at least two PCBs arranged in a rotated state, portions of the legs being bent and respectively extended in another direction from opposite ends of the body, the bent and extended portions of the legs being inserted through connection holes respectively formed in the at least two PCBs, and bent and extended terminals of the legs respectively being bent inward to be tightly fixed to lower surfaces of the at least two PCBs.

The invention relates to A nose cone assembly for a munition, comprising a transducer array operably linked to a transmission assembly, wherein the transducer array is operably connected to a transducer housing, said transducer housing comprising a first and second surface, wherein said transmission assembly is reversibly operably connected to the second surface of said transducer housing, said transmission assembly comprising a control board and a plurality of electronic circuit boards, wherein at least one electronic circuit board is a transceiver circuit board, said electronic circuit boards being reversibly connected to the control board and being arranged along their longest dimension, at an axis substantially perpendicular to the control board and further arranged such that the electronic circuit boards extend radially inwardly to a substantially rotational centre of the control board.

Disclosed is an industrial control device including a point-to-point backplane/point module architecture providing RIUP (Removal and Insertion Under Power) functionality where data communications between modules is maintained after the removal of a point module from the backplane. According to an exemplary embodiment, a backplane includes a plurality of passive mechanical bypass switches controlled by the insertion and removal of respective point modules, whereby data communicated bypass a removed point module interface and point-to-point data communications are provided to an inserted point module after an initial routine is executed by a microcontroller associated with the inserted point module.

Assemblies include at least one substrate, at least one electronic device coupled to the substrate, and heat dissipation elements. The heat dissipation elements comprise at least one heat spreader in communication with the at least one electronic device and at least one heat sink in communication with the at least one heat spreader. Methods of dissipating heat energy include transferring heat energy from memory devices to heat spreaders positioned adjacent to the memory devices and transferring the heat energy from the heat spreaders to a heat sink.

A three-dimensional optoelectronic device package is disclosed. The three-dimensional optoelectronic device package comprises a first board having at least one surface on which one or more optoelectronic devices is disposed, and a second board having at least one surface on which a plurality of optoelectronic devices is disposed. A side of the second board is attached to the surface of the first board on which one or more optoelectronic devices is disposed to form an angle between the surface of the first board on which one or more optoelectronic devices is disposed and the surface of the second board on which one or more optoelectronic devices is disposed. A method for manufacturing a three-dimensional optoelectronic device package is also disclosed.

An electrical connection base providing support for heavy expansion cards includes a pedestal and a supporting element. A socket is defined on the pedestal. The supporting element includes installation and support portion. A through hole is defined on the installation portion, which is portion set outside the pedestal, the pedestal entering the through hole. The support portion has a first slot, and the first slot runs through the end of the support portion away from the installation portion. The portion of the expansion card or other element plugged into the socket and outside the pedestal is inserted into the first slot. The groove wall of the first slot is in contact with the element, the support portion thereby supports the card or element and prevents strain and deformation.